Patents by Inventor Tomoshi Oode

Tomoshi Oode has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module
    Patent number: 10861838
    Abstract: The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: December 8, 2020
    Assignee: SONY CORPORATION
    Inventors: Toshiaki Iwafuchi, Takayuki Ezaki, Tomoshi Oode
  • OPTICAL MODULE
    Publication number: 20190148350
    Abstract: The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Application
    Filed: January 8, 2019
    Publication date: May 16, 2019
    Inventors: TOSHIAKI IWAFUCHI, TAKAYUKI EZAKI, TOMOSHI OODE
  • Optical module
    Patent number: 10211192
    Abstract: [Object] To suppress appearance of a ghost. [Solving Means] The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: February 19, 2019
    Assignee: SONY CORPORATION
    Inventors: Toshiaki Iwafuchi, Takayuki Ezaki, Tomoshi Oode
  • OPTICAL MODULE
    Publication number: 20170200710
    Abstract: [Object] To suppress appearance of a ghost. [Solving Means] The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 13, 2017
    Inventors: Toshiaki IWAFUCHI, Takayuki EZAKI, Tomoshi OODE
  • Optical module
    Patent number: 9607972
    Abstract: To suppress appearance of a ghost. The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: March 28, 2017
    Assignee: SONY CORPORATION
    Inventors: Toshiaki Iwafuchi, Takayuki Ezaki, Tomoshi Oode
  • OPTICAL MODULE
    Publication number: 20150076640
    Abstract: To suppress appearance of a ghost. The present optical module includes a sensor configured to pick up an image of an image pickup object, and a memory chip configured to store pixel data read out from the sensor and having the sensor joined thereto. The memory chip is connected to a substrate by a connection portion by flip-chip connection. The sensor can be connected by a wire to the memory chip, to which the sensor is joined. Further, the sensor can be joined to the memory chip in such a manner as to project toward an opening of the substrate. The present technology can be applied to a camera module.
    Type: Application
    Filed: April 16, 2013
    Publication date: March 19, 2015
    Inventors: Toshiaki Iwafuchi, Takayuki Ezaki, Tomoshi Oode