Abstract: An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.

Abstract: An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.

Abstract: An electronic component mounting apparatus in which an electronic component may be checked to provide highly accurate and efficient electronic component mounting. The apparatus includes a camera unit fixed on a head support and images an electronic component absorbed or to be absorbed onto a nozzle. The camera unit contains a camera module including a camera obtaining an image, a first lighting section disposed adjacently on a side of the camera closer to the nozzle and emitting light toward an imaging region of the camera, a second lighting section disposed adjacently on a side of the camera farther from the nozzle and emitting light toward the imaging region of the camera, and a baffle; and a bracket fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.