Abstract: A piezoelectric device includes a base, a piezoelectric vibrating piece, and a cover. The base has a depressed portion and a bank portion. The piezoelectric vibrating piece is housed within the depressed portion. The cover is bonded on a top surface of the bank portion of the base with a sealing metal. The top surface of the base has an inclined surface that inclines down toward an inside of the base in a direction along a width direction of the bank portion or an inclined surface that inclines down toward an outside of the base in the direction along the width direction of the bank portion.

Abstract: A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

Abstract: A piezoelectric device includes a base, a piezoelectric vibrating piece, and a cover. The base has a depressed portion and a bank portion. The piezoelectric vibrating piece is housed within the depressed portion. The cover is bonded on a top surface of the bank portion of the base with a sealing metal. The top surface of the base has an inclined surface that inclines down toward an inside of the base in a direction along a width direction of the bank portion or an inclined surface that inclines down toward an outside of the base in the direction along the width direction of the bank portion.

Abstract: A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

Abstract: A method for fabricating a crystal unit, including a preparing step, a bonding step, and a separating step, is provided. The preparing step prepares a quartz plate and a supporting substrate with a recess that is larger than the vibrating region on a surface of the supporting substrate. The recess corresponds to a vibrating region in the crystal unit. The bonding step bonds the quartz plate to the surface of the supporting substrate such that the quartz plate is separated from the supporting substrate in the recess. The separating step separates the quartz plate into the vibrating region and the framing portion by performing dry etching on the quartz plate such that the quartz plate has a shape that connects the vibrating region to the framing portion via a supporting beam. The framing portion surrounds the vibrating region.

Abstract: Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing.

Abstract: A vehicular airbag device includes an airbag and an opening degree change portion. The airbag is folded and accommodated in an accommodation portion provided in front of a vehicle seat. The airbag is deployed toward an occupant seated in the vehicular seat by being supplied with a gas when a head-on collision occurs, and has a vent hole that allows the gas to be discharged in restraining the occupant. The opening degree change portion changes an opening area of the vent hole in accordance with a direction of impact of an upper body of the occupant with the airbag during deployment of the airbag.

Abstract: A front passenger airbag device includes an airbag that deploys toward a front seat passenger, and an airbag door provided in a dashboard. The airbag door includes a central door that opens in a vehicle longitudinal direction, and lateral end doors that are provided on the lateral sides of the central door to open in the vehicle width direction due to the inflation pressure of the airbag. The inflation pressure of the airbag acts on the respective lateral end doors almost exclusively during the initial stage of the airbag deployment.

Abstract: A passenger seat air bag apparatus includes an air bag which is housed folded inside an instrument panel, and inflates toward a passenger who is seated in a front passenger seat with a supply of gas during a frontal collision, and which has a vent hole that can be opened and closed; a first strap which is connected to both an area around the vent hole and a rear lower portion of a base cloth of the air bag in the longitudinal direction of the vehicle, and which closes the vent hole as the air bag inflates; and a second strap which is connected to an edge portion of the vent hole, and pulls on the edge portion of the vent hole and on the first strap around the vent hole so as to open the vent hole when the passenger who is wearing a seatbelt is restrained by the air bag.

Abstract: An airbag device includes: a bag body that is deployed by internal pressure rising as a gas is supplied into the bag body; and a gas pressure adjustment portion that is provided on the bag body so as to be able to release the gas from the inside of the bag body during a deployed state of the bag body, and that is set so that the amount of the gas released from the bag body in the deployed state to an inward side in a vehicle width direction is larger than the amount of the gas released from the bag body in the deployed state to an outward side in the vehicle width direction.

Abstract: To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract: A vehicular airbag device includes an airbag and an opening degree change portion. The airbag is folded and accommodated in an accommodation portion provided in front of a vehicle seat. The airbag is deployed toward an occupant seated in the vehicular seat by being supplied with a gas when a head-on collision occurs, and has a vent hole that allows the gas to be discharged in restraining the occupant. The opening degree change portion changes an opening area of the vent hole in accordance with a direction of impact of an upper body of the occupant with the airbag during deployment of the airbag.

Abstract: A front passenger airbag device includes an airbag that deploys toward a front seat passenger, and an airbag door provided in a dashboard. The airbag door includes a central door that opens in a vehicle longitudinal direction, and lateral end doors that are provided on the lateral sides of the central door to open in the vehicle width direction due to the inflation pressure of the airbag. The inflation pressure of the airbag acts on the respective lateral end doors almost exclusively during the initial stage of the airbag deployment.

Abstract: A passenger seat air bag apparatus includes an air bag which is housed folded inside an instrument panel, and inflates toward a passenger who is seated in a front passenger seat with a supply of gas during a frontal collision, and which has a vent hole that can be opened and closed; a first strap which is connected to both an area around the vent hole and a rear lower portion of a base cloth of the air bag in the longitudinal direction of the vehicle, and which closes the vent hole as the air bag inflates; and a second strap which is connected to an edge portion of the vent hole, and pulls on the edge portion of the vent hole and on the first strap around the vent hole so as to open the vent hole when the passenger who is wearing a seatbelt is restrained by the air bag.

Abstract: An airbag device includes: a bag body that is deployed by internal pressure rising as a gas is supplied into the bag body; and a gas pressure adjustment portion that is provided on the bag body so as to be able to release the gas from the inside of the bag body during a deployed state of the bag body, and that is set so that the amount of the gas released from the bag body in the deployed state to an inward side in a vehicle width direction is larger than the amount of the gas released from the bag body in the deployed state to an outward side in the vehicle width direction.

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract: Electronic devices are disclosed that allow for surface-mounting using solder while preventing solder from overflowing between external terminals of the electronic device, or between pads on a circuit board to which the external terminals are soldered. An exemplary electronic device has a base board made of an insulating material and having an outer surface comprising at least one external terminal for surface mounting of the device to the circuit board. A groove is defined at least part way around the external terminal on the outer surface. The groove accommodates overflowed solder and thus prevents unintended spread flow of the solder to locations that otherwise could cause short circuits and the like. The electronic device can include a resin board containing a thermoset resin, wherein the groove is formed by thermal or mechanical processing.

Abstract: To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.