Abstract: Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V2/V1 in the range of 5.0×10?2 to 1.0×102, wherein V1 (dPa·s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V2 (dPa·s) is the minimum value of the melt viscosity measured at 60° C. to 100° C.

Abstract: Provided is a curable resin composition which can be suitably used as a hole filling material for a printed wiring board having excellent characteristics such as noise suppression and a high flexibility in wiring formation. A curable resin composition comprising at least a curable resin and a magnetic filler, wherein the viscosity of the curable resin composition is 100 to 3000 (dPa·s) at 5.0 rpm as measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011, and a cured product obtained by curing the curable resin composition at 150° C. for 30 minutes has an insulation resistance value of 1.0×105? or more.

Abstract: Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V2/V1 in the range of 5.0×10?2 to 1.0×102, wherein V1 (dPa·s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V2 (dPa·s) is the minimum value of the melt viscosity measured at 60° C. to 100° C.