Abstract: An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.

Abstract: Provided is a resin composition for forming a hard coating layer, which is capable of forming a cured product having not only high hardness but also excellent scratch resistance, bending resistance, and crack resistance. The resin composition according to an embodiment of the present invention contains components (A) to (D) below: the component (A): a tri- or higher-functional alicyclic epoxy compound and/or a tri- or higher-functional oxetane compound; the component (B): a polyfunctional (meth)acrylic compound; the component (C): a photocationic polymerization initiator; and the component (D): a photoradical polymerization initiator.

Abstract: Provided is a resin composition that can form a cured product having crack resistance, a high surface hardness, and excellent scratch resistance. The resin composition according to an embodiment of the present invention contains components (A) to (E) below. Component (A): a polyfunctional alicyclic epoxy compound having a molecular weight of less than 10000; component (B): a polyfunctional (meth)acrylic compound having a molecular weight of less than 10000; component (C): a linear polymer having, in a side chain thereof, a functional group that is reactive with a functional group of the component (A) and/or the component (B), and having a weight average molecular weight (in terms of polystyrene by GPC) of 10000 or greater; component (D): a photocationic polymerization initiator; and component (E): a photoradical polymerization initiator.

Abstract: A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.

Abstract: A curable composition according to the present invention for sealing optical semiconductor includes components (A), (B), and (C). Another curable composition according to the present invention for sealing optical semiconductor further includes a component (D) in addition to the components (A), (B) and (C). The component (A) is a compound containing at least one functional group selected from the group consisting of epoxy groups, oxetanyl groups, vinyl ether groups, and (meth)acryloyl groups. The component (B) is a cycloaliphatic epoxy compound. The component (C) is a curing catalyst including a cationic component and an anionic component and generating an acid upon application of light or heat, where the cationic component contains an aromatic ring, and the anionic component contains a central element selected from boron and phosphorus. The component (D) is conductive fiber-bearing particles each including a particulate substance and a fibrous conductive substance lying on or over the particulate substance.

Abstract: Provided is a metallosiloxane compound (A) prepared by reacting a bifunctional silane compound (S1), a monofunctional silane compound (S2), a boron compound (M), and optionally H2O in a molar ratio of [the silane compound (S1)]:[the silane compound (S2)]:[the boron compound (M)]:[H2O] of n:m:k:a, where n, m, k, and a satisfy all conditions (i), (ii), and (iii), in which the metallosiloxane compound has at least one Si—H bond or C2-10 alkenyl group per molecule, and the conditions (i), (ii), and (iii) are expressed as follows: (i) n>0, m>0, k>0, a?0; (ii) m/n?0.5; and (iii) (n+m)/k?1.8.

Abstract: Provided is a metallosiloxane compound (A) prepared by reacting a bifunctional silane compound (S1), a monofunctional silane compound (S2), a boron compound (M), and optionally H2O in a molar ratio of [the silane compound (S1)]:[the silane compound (S2)]:[the boron compound (M)]: [H2O] of n:m:k:a, where n, m, k, and a satisfy all conditions (i), (ii), and (iii), in which the metallosiloxane compound has at least one Si—H bond or C2-10 alkenyl group per molecule, and the conditions (i), (ii), and (iii) are expressed as follows: (i) n>0, m>0, k>0, a?0; (ii) m/n?0.5; and (iii) (n+m)/k?1.