Abstract: A motor control system includes an inverter, and a control calculation unit that feedback-controls the inverter. The control calculation unit includes a voltage control calculation unit that calculates a voltage command value indicating a voltage to be applied to the motor from the inverter on the basis of a current deviation between a current command value and an actual current detection value, a torque ripple compensation calculation unit that adds a compensation value for compensating a torque ripple in the motor to a signal value on at least one of an upstream side and a downstream side in a signal flow that passes through the voltage control calculation unit, and a current limit calculation unit that limits the current command value by adaptive control based on an actual angular velocity value indicating an angular velocity at which the motor rotates.

Abstract: A motor control system includes an inverter, a voltage control calculating a voltage command value indicating a voltage to be applied to a motor from the inverter based on a deviation between the current command value and the actual current detection value, and a torque ripple compensation unit adding a compensation value for compensating a torque ripple in the motor to a signal value on an upstream side in a signal flow that passes through the voltage control unit. The torque ripple compensation unit includes a phase compensator calculating a compensation value component in the voltage control unit based on an actual angular velocity value indicating an angular velocity at which the motor rotates, and an inverse characteristic processor calculating a compensation value component for compensating the torque ripple based on an inverse characteristic of an open loop transfer function in a feedback control.

Abstract: There is an inspection system including multiple inspection units configured to inspect substrates, wherein each of the inspection units includes: a tester configured to inspect a substrate; a moving part configured to hold and move the substrate relative to the tester; and a frame structure configured to accommodate the tester and the moving part, wherein the frame structure of one inspection unit includes: a first frame to be connected to a frame structure of another inspection unit; and a second frame that accommodates at least the moving part and is configured to move relative to the first frame to extract the moving part from the first frame.

Abstract: An operating device has: a lever configured to be operated by tilting; a resistor having a flat strip shape and provided on a surface of a substrate; and a slider configured to change an output voltage value by sliding on a surface of the resistor in accordance with tilting operation of the lever. In this operating device, the resistor has a low-resistance portion that has a lower resistance value than other portions of the resistor, and that is a portion in contact with the slider when the lever is in a neutral position.

Abstract: An inspection apparatus includes: a plurality of inspection devices configured to respectively inspect electronic devices of inspection objects on a plurality of chuck tops; a measurement device configured to measure height positions of a plurality of points on a surface of each of the plurality of chuck tops, which are respectively disposed to correspond to the plurality of inspection devices, or to measure distances in a height direction from a measurement reference point to the plurality of points; a calculation device configured to calculate adjustment amounts in the height direction at the plurality of points of each chuck top, based on the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points; and an adjustment mechanism configured to adjust, for each chuck top, an angle of the respective chuck top based on the adjustment amounts.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A testing apparatus includes a first coordinates obtaining unit, a second coordinates obtaining unit, and a controller that performs determining card gravity center coordinates of a probe card held at a pogo frame opposite to an alignment stage, determining reference coordinates in a target coordinate system of a reference target at predetermined coordinates, determining alignment coordinates when the first coordinates obtaining unit is aligned with the second coordinates obtaining unit, determining wafer gravity center coordinates of a wafer, and calculating contact coordinates by using the determined card gravity center coordinates, the determined alignment coordinates, and the determined wafer gravity center coordinates.

Abstract: A method for controlling a test apparatus, the test apparatus including a test unit in which testers are arranged in columns and rows, each tester configured to test a substrate; aligners each configured to cause the substrate to be contacted with respect to a given tester from among the testers, at least one aligner provided in each row; and a controller configured to control the aligners. The method includes constraining, by the controller, operation of at least a second aligner, while alignment is performed through a first aligner from among the aligners.

Abstract: An operation device includes a housing, a tiltable cylindrical operation member having a step portion on an inner circumferential surface, a first holding member which is held by the housing and rotatable in a first direction in accordance with a tilting operation of the operation member, a first detecting portion for detecting a rotation of the first holding member, and a returning mechanism disposed inside the operation member to return the tilted operation member to an initial position, wherein the returning mechanism includes an actuator, a slide member having a first cam surface at one end, a cam member having a second cam surface at one end which faces the first cam surface, a first elastic member, and a second elastic member.

Abstract: An inspection system configured to inspect a device within a substrate is provided. The inspection system includes an inspection module, an alignment module, a supporting device and a fixing device. The inspection module has multiple testers and multiple inspection chambers. The multiple testers are allowed to be accommodated in the multiple inspection chambers, respectively. The alignment module has an aligner. The aligner is placed in an alignment space. The aligner is configured to adjust a position of the substrate to be inspected with respect to one tester of the multiple testers, which is accommodated in the alignment space. The supporting device is configured to support the tester accommodated in the alignment space from below. The fixing device is configured to fix the tester accommodated in the alignment space in cooperation with the supporting device.

Abstract: A method of controlling a placement apparatus including a stage, a support table, a rotary drive mechanism rotating the stage including a first motion conversion mechanism configured to convert a rotary motion of a drive motor into a linear motion of a moving body and a second motion conversion mechanism configured to convert a linear motion of the moving body into a rotary motion of the stage, and a controller. The method includes a first correction step of calculating a first correction value of a drive angle of the stage for a linear movement amount of the moving body, a second correction step of obtaining a second correction value based on an error for each predetermined pitch, and a drive step of rotationally driving the stage based on the first and second correction values obtained in the first correction step and the second correction step.

Abstract: An inspection apparatus configured to inspect a target object includes an inspector configured to perform an inspection of an electrical characteristic upon the target object; a gas flow source provided within the inspector and configured to generate a gas flow which cools an inside of the inspector; a position adjuster configured to place the target object thereon and perform a position adjustment between the placed target object and the inspector; a housing which accommodates the inspector and the position adjuster in a same space; and a circulation device configured to circulate a gas by the gas flow source between the inside of the inspector and a region where the position adjuster is located within the space, the circulation device including a cooler configured to cool the gas being circulated and a foreign substance remover configured to remove a foreign substance from the gas being circulated.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A testing apparatus includes a first coordinates obtaining unit, a second coordinates obtaining unit, and a controller that performs determining card gravity center coordinates of a probe card held at a pogo frame opposite to an alignment stage, determining reference coordinates in a target coordinate system of a reference target at predetermined coordinates, determining alignment coordinates when the first coordinates obtaining unit is aligned with the second coordinates obtaining unit, determining wafer gravity center coordinates of a wafer, and calculating contact coordinates by using the determined card gravity center coordinates, the determined alignment coordinates, and the determined wafer gravity center coordinates.

Abstract: An inspection apparatus includes: a plurality of inspection devices configured to respectively inspect electronic devices of inspection objects on a plurality of chuck tops; a measurement device configured to measure height positions of a plurality of points on a surface of each of the plurality of chuck tops, which are respectively disposed to correspond to the plurality of inspection devices, or to measure distances in a height direction from a measurement reference point to the plurality of points; a calculation device configured to calculate adjustment amounts in the height direction at the plurality of points of each chuck top, based on the height positions of the plurality of points or the distances in the height direction from the measurement reference point to the plurality of points; and an adjustment mechanism configured to adjust, for each chuck top, an angle of the respective chuck top based on the adjustment amounts.

Abstract: An aligning mechanism according to one aspect of the present disclosure includes a mounting table on which a substrate is placed; a holding section configured to hold the mounting table from below; lifting pins configured to raise or lower the mounting table with respect to the holding section; and an aligner configured to support the holding section from below, and to change a position of the holding section relative to the lifting pins. In the holding section and the aligner, through-holes are formed such that the lifting pins can penetrate the through-holes.

Abstract: In a substrate transportation method, a first movement process is provided for moving a camera to a position above a predetermined region where a peripheral edge of a substrate is supposed to be located in a state where the substrate is lifted by pins protruding beyond a mounting table while a transfer mechanism that has received an instruction for starting an unloading of the substrate mounted on the mounting table is moving to the mounting table. Further, a first image capturing process is provided for controlling the camera moved in the first movement process to capture an image of the predetermined region, and a first detection process is provided for detecting a positional displacement and/or a tilting of the substrate lifted by the pins based on the image captured by the camera in the first image capturing process.

Abstract: An operation device includes a housing, a tiltable cylindrical operation member having a step portion on an inner circumferential surface, a first holding member which is held by the housing and rotatable in a first direction in accordance with a tilting operation of the operation member, a first detecting portion for detecting a rotation of the first holding member, and a returning mechanism disposed inside the operation member to return the tilted operation member to an initial position, wherein the returning mechanism includes an actuator, a slide member having a first cam surface at one end, a cam member having a second cam surface at one end which faces the first cam surface, a first elastic member, and a second elastic member.

Abstract: A method for controlling a test apparatus, the test apparatus including a test unit in which testers are arranged in columns and rows, each tester configured to test a substrate; aligners each configured to cause the substrate to be contacted with respect to a given tester from among the testers, at least one aligner provided in each row; and a controller configured to control the aligners. The method includes constraining, by the controller, operation of at least a second aligner, while alignment is performed through a first aligner from among the aligners.

Abstract: A method of controlling a placement apparatus including a stage, a support table, a rotary drive mechanism rotating the stage including a first motion conversion mechanism configured to convert a rotary motion of a drive motor into a linear motion of a moving body and a second motion conversion mechanism configured to convert a linear motion of the moving body into a rotary motion of the stage, and a controller. The method includes a first correction step of calculating a first correction value of a drive angle of the stage for a linear movement amount of the moving body, a second correction step of obtaining a second correction value based on an error for each predetermined pitch, and a drive step of rotationally driving the stage based on the first and second correction values obtained in the first correction step and the second correction step.