Patents by Inventor Tomoya HAMADA

Tomoya HAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12074339
    Abstract: Provided is a separator for a non-aqueous secondary battery, containing a porous substrate; a heat resistant porous layer that is provided on one side or on both sides of the porous substrate, and that contains a porous coating film including at least one selected from the group consisting of a wholly aromatic polyamide, a polyamide imide and a polyimide; and an adhesive layer that is provided on one side or on both sides of a layered body containing the porous substrate and the heat resistant porous layer, in which adhesive resin particles adhere to the layered body, and provided is a separator for a non-aqueous secondary battery, containing a porous substrate; a heat resistant porous layer that is provided on one side or on both sides of the porous substrate, and that contains at least one of inorganic particles or a heat resistant resin, the heat resistant resin having at least one of an amide bond or an imide bond in a molecule; and an adhesive layer that is provided on one side or on both sides of a laye
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 27, 2024
    Assignee: TEIJIN LIMITED
    Inventors: Tomoya Hamada, Susumu Honda
  • Patent number: 11777175
    Abstract: A separator includes a porous substrate, and a porous layer formed on one or both surfaces of the substrate and containing a polyvinylidene fluoride type resin and a filler, in which the filler content in the porous layer is from 30 to 80% by mass with respect to the total mass of the polyvinylidene fluoride type resin and the filler, and the polyvinylidene fluoride type resin is at least one resin selected from the following resin A and B: resin A: a copolymer having a weight average molecular weight of from 100,000 to 350,000, and a content of HFP is more than 5% by mass but not more than 11% by mass; and resin B: a copolymer having a weight average molecular weight of from 100,000 to 1,000,000, in which a content of HFP is more than 11% by mass but not more than 15% by mass.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 3, 2023
    Assignee: TEIJIN LIMITED
    Inventors: Susumu Honda, Satoshi Nishikawa, Takashi Yoshitomi, Tomoya Hamada, Yoshimitsu Takano
  • Publication number: 20210057703
    Abstract: Provided is a separator for a non-aqueous secondary battery, containing a porous substrate; a heat resistant porous layer that is provided on one side or on both sides of the porous substrate, and that contains a porous coating film including at least one selected from the group consisting of a wholly aromatic polyamide, a polyamide imide and a polyimide; and an adhesive layer that is provided on one side or on both sides of a layered body containing the porous substrate and the heat resistant porous layer, in which adhesive resin particles adhere to the layered body, and provided is a separator for a non-aqueous secondary battery, containing a porous substrate; a heat resistant porous layer that is provided on one side or on both sides of the porous substrate, and that contains at least one of inorganic particles or a heat resistant resin, the heat resistant resin having at least one of an amide bond or an imide bond in a molecule; and an adhesive layer that is provided on one side or on both sides of a laye
    Type: Application
    Filed: November 30, 2018
    Publication date: February 25, 2021
    Applicant: TEIJIN LIMITED
    Inventors: Tomoya HAMADA, Susumu HONDA
  • Publication number: 20180190957
    Abstract: A separator includes a porous substrate, and a porous layer formed on one or both surfaces of the substrate and containing a polyvinylidene fluoride type resin and a filler, in which the filler content in the porous layer is from 30 to 80% by mass with respect to the total mass of the polyvinylidene fluoride type resin and the filler, and the polyvinylidene fluoride type resin is at least one resin selected from the following resin A and B: resin A: a copolymer having a weight average molecular weight of from 100,000 to 350,000, and a content of HFP is more than 5% by mass but not more than 11% by mass; and resin B: a copolymer having a weight average molecular weight of from 100,000 to 1,000,000, in which a content of HFP is more than 11% by mass but not more than 15% by mass.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 5, 2018
    Applicant: TEIJIN LIMITED
    Inventors: Susumu HONDA, Satoshi NISHIKAWA, Takashi YOSHITOMI, Tomoya HAMADA, Yoshimitsu TAKANO