Abstract: A wiring substrate includes an insulator and first and second conductors. The insulator has a first top surface, a first side surface, and first and second recesses. The first conductor is positioned on the first top surface and has a first end surface. The second conductor is positioned on the first top surface and has a second end surface. The first recess contacts the first and second end surfaces. The second recess is between the first and second conductors. The first recess extends in a second direction and has a first inner side surface and a first bottom surface. The second recess has a second inner side surface and a second bottom surface. The distance from the first top surface to the first bottom surface in a third direction is smaller than the distance from the first top surface to the second bottom surface in the third direction.

Abstract: A semiconductor package includes an insulating substrate a pair of signal electrodes, a pair of differential lines, and a ground conductor. The pair of differential lines are respectively connected to the signal electrodes. Each differential line includes a first signal line, a second signal line, a first via-hole conductor, and a second via-hole conductor. The ground conductor includes a ground plane, a ground plane, and a ground via-hole conductor. The ground plane sandwiches the first signal line between the ground plane and the ground plane and forms a stripline structure. The ground via-hole conductor is located along the second via-hole conductor and forms a coaxial structure. In planar perspective view of the first surface, a position on a plane including the ground plane including the second end portion is located in a gap region.

Abstract: A wiring substrate includes a substrate having a first surface, a first lead terminal in contact with a ground conductor on the first surface, and a second lead terminal in contact with a signal conductor on the first surface and aligned with the first lead terminal. The first lead terminal includes a first end, a contacting part, a connecting part, a lead part and a second end. The contacting part includes the first end and is in contact with the ground conductor. The connecting part includes a first bend, a short-distance part and a second bend. The first bend is away from the first end across the contacting part. The second bend is closer to the second end than the first bend. The short-distance part has a shorter distance to the second lead terminal than the contacting part in plan view toward the first surface.

Abstract: Disclosed is an electronic component accommodation package, including: a substrate that has an upper surface including a mounting area; and a frame that is on the upper surface of the substrate to surround the mounting are. The frame includes: a first frame that contains a ceramic material; a second frame that has a through hole and that contains a metal material; and a third frame that contains a metal material. The first frame includes a first end and a second end, and the second frame includes a third end and a fourth end. The first end of the first frame and the fourth end of the second frame are joined to each other via a joining material, and the second end of the first frame and the third end of the second frame are joined to each other via a joining material.

Abstract: The present invention relates to improvement of light emitting property of a lighting apparatus having a plurality of light sources. The light emitting apparatus comprises a plurality of reflection unit (100u) and a plurality of light sources (13). Each of the plurality of reflection unit (100u) includes a first reflection surface (12a) and a plurality of second reflection surfaces (12b). Each of the plurality of second reflection surfaces (12b) is arranged around the first reflection surface (12a) and has a shape different from that of the first reflection surface (12a). Each of the plurality of light sources (13) includes a light emitting element made of a semiconductor material. The plurality of light sources (13) are arranged within the first reflection surface (12a) and the second reflection surfaces (12b).

Abstract: The present invention relates to improvement of light emitting property of a lighting apparatus having a plurality of light sources. The light emitting apparatus comprises a plurality of reflection unit (100u) and a plurality of light sources (13). Each of the plurality of reflection unit (100u) includes a first reflection surface (12a) and a plurality of second reflection surfaces (12b). Each of the plurality of second reflection surfaces (12b) is arranged around the first reflection surface (12a) and has a shape different from that of the first reflection surface (12a). Each of the plurality of light sources (13) includes a light emitting element made of a semiconductor material. The plurality of light sources (13) are arranged within the first reflection surface (12a) and the second reflection surfaces (12b).