Patents by Inventor TOMOYA MORIURA

TOMOYA MORIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded body for electronic function, method for manufacturing the same, and operation device using molded body for electronic function
    Patent number: 11507229
    Abstract: A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: November 22, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroshi Morioka, Takashi Morimoto, Hideaki Eto, Tomoya Moriura, Wahei Agemizu
  • MOLDED BODY FOR ELECTRONIC FUNCTION, METHOD FOR MANUFACTURING THE SAME, AND OPERATION DEVICE USING MOLDED BODY FOR ELECTRONIC FUNCTION
    Publication number: 20210157427
    Abstract: A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.
    Type: Application
    Filed: November 16, 2020
    Publication date: May 27, 2021
    Inventors: HIROSHI MORIOKA, TAKASHI MORIMOTO, HIDEAKI ETO, TOMOYA MORIURA, WAHEI AGEMIZU