Patents by Inventor Tomoya Sawamura

Tomoya Sawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150257268
    Abstract: A printed wiring board includes a core substrate, and a buildup layer formed on the core substrate and including an interlayer resin insulation layer and a conductive layer. The core substrate includes a metal core, a first insulation layer on first surface of the metal core, a first conductive layer on the first insulation layer, a second insulation layer on second surface of the metal core, and a second conductive layer on the second insulation layer, the metal core has a penetrating hole penetrating from the first surface to the second surface and a resin portion filling the penetrating hole, the resin portion includes resin material from the first insulation layer, the core substrate has a through-hole conductor formed in the resin portion through the metal core, the interlayer resin insulation layer has a core material, and the first insulation layer does not have a core material.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Katsutoshi KITAGAWA, Tomoya Sawamura