Abstract: A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.

Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.

Abstract: A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.

Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures.