Abstract: According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. The circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. The bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. The bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.

Abstract: It is provided that a polypropylene-based laminated film having high heat resistance and stiffness. A polypropylene-based laminated film comprising: a base layer (A) that is formed of a polypropylene-based resin satisfying following conditions 1) to 4) and contains an antifogging agent; and a heat seal layer (B) formed on one or both surfaces of the base layer (A) and formed of a polyolefin-based resin, wherein a lower limit of a plane orientation coefficient of the film is 0.0125, 1) a lower-limit mesopentad fraction is 96%, 2) an upper-limit amount of a copolymerization monomer other than propylene is 0.1 mol %, 3) mass average molecular weight (Mw)/number average molecular weight (Mn) is 3.0 or more and 5.4 or less, and 4) a melt flow rate (MFR) measured at 230° C. and 2.16 kgf is 6.2 g/10 min or more and 9.0 g/10 min or less.

Abstract: Disclosed is a polypropylene-based resin multilayer film that has suitability for automatic packaging thanks to its low temperature sealing properties and high heat seal strength, and can be used for various purposes thanks to its suitability for gusset packaging. The film has a base layer (A), a surface layer (B) on one side of the base layer (A), and a seal layer (C) on the other side of the base layer (A); satisfying a) a heat shrinkage ratio in a longitudinal direction at 120° C. of 3.0% or less, b) an onset temperature of heat seal strength of the seal layer (C) of 100° C. to 115° C., c) an onset temperature of heat seal strength of the surface layer (B) of 125° C. to 140° C., and d) a thickness of the seal layer (C) in the range of 5% to 15% with respect to a total thickness of the film.

Abstract: It is provided that a polypropylene-based laminated film having high heat resistance and stiffness. A polypropylene-based laminated film comprising: a base layer (A) that is formed of a polypropylene-based resin satisfying following conditions 1) to 4) and contains an antifogging agent; and a heat seal layer (B) formed on one or both surfaces of the base layer (A) and formed of a polyolefin-based resin, wherein a lower limit of a plane orientation coefficient of the film is 0.0125, 1) a lower-limit mesopentad fraction is 96%, 2) an upper-limit amount of a copolymerization monomer other than propylene is 0.1 mol %, 3) mass average molecular weight (Mw)/number average molecular weight (Mn) is 3.0 or more and 5.4 or less, and 4) a melt flow rate (MFR) measured at 230° C. and 2.16 kgf is 6.2 g/10 min or more and 9.0 g/10 min or less.