Patents by Inventor Tomoyo OKUMURA

Tomoyo OKUMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyamide composition and molded article
    Patent number: 11192979
    Abstract: The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan ? peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000?Mw?35,000. The invention also provides a molded article or the like formed using the polyamide composition.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 7, 2021
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Shinji Ieda, Koichi Nagase, Hisho Yamada, Jun Mikami, Takayuki Wakita, Yoshifumi Araki, Kimiaki Kawatani, Tomoyo Okumura, Yoshikimi Kondo, Kazunori Terada
  • POLYAMIDE COMPOSITION AND MOLDED ARTICLE
    Publication number: 20200087458
    Abstract: The present invention provides a polyamide composition containing 50 to 99 parts by mass of an aliphatic polyamide (1A) formed from a diamine and a dicarboxylic acid, and 1 to 50 parts by mass of a semi-aromatic polyamide (1B) containing a dicarboxylic acid unit that includes at least 75 mol % of isophthalic acid and a diamine unit that includes at least 50 mol % of a diamine of 4 to 10 carbon atoms, wherein the tan ? peak temperature of the polyamide composition is at least 90° C., and the weight average molecular weight Mw of the polyamide composition satisfies 15,000?Mw?35,000. The invention also provides a molded article or the like formed using the polyamide composition.
    Type: Application
    Filed: March 30, 2018
    Publication date: March 19, 2020
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Shinji IEDA, Koichi NAGASE, Hisho YAMADA, Jun MIKAMI, Takayuki WAKITA, Yoshifumi ARAKI, Kimiaki KAWATANI, Tomoyo OKUMURA, Yoshikimi KONDO, Kazunori TERADA