Abstract: An interposer includes a plurality of first connection electrodes each of which is arranged on either of first- and second-side-surface sides of a first principal surface of a substrate; a plurality of second connection electrodes each of which is arranged on either of first- and second-side-surface sides of a second principal surface of the substrate; and a plurality of third connection electrodes each of which is arranged on either of first and second side surfaces. Each of the first connection electrodes has a first portion located away from an edge of the first principal surface, and a second portion extending from the first portion to the edge and connected to the third connection electrode. Each of the second portion of each first connection electrode and the plurality of third connection electrodes has a width smaller than a width of the first portion of each first connection electrode.

Abstract: An electronic component includes a multilayer capacitor and an interposer The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate, a pair of first electrodes, and is pair of second electrodes. The substrate includes first and second principal faces. The pair of first electrodes are disposed on the first principal face. The pair of second electrodes are disposed on the second principal thee. The element body includes a first portion and a pair of second portions. The first portion is covered by the external electrodes. The pair of second portions are located on both sides or the first portion and separated from the interposer. A width in a second direction of the pair of external electrodes is smaller than a width in the second direction of the element body and larger than a width in the second direction of the second portion.

Abstract: An electronic component includes a multilayer capacitor and an interposer. The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate having first and second principal faces, a pair of first electrodes disposed on the first principal face, and a pair of second electrodes disposed on the second principal face so as to be separated from the pair of first electrodes in a first direction or in a second direction. Widths of the pair of external electrodes and the pair of first electrodes are smaller than a width of the element body. The element body has a first portion covered by the external electrode, and a pair of second portions located on both sides of the first portion. The pair of second portions are separated from the interposer and overlap the pair of second electrodes when viewed from a third direction.

Abstract: An electronic component includes a multilayer capacitor and an interposer The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate, a pair of first electrodes, and is pair of second electrodes. The substrate includes first and second principal faces. The pair of first electrodes are disposed on the first principal face. The pair of second electrodes are disposed on the second principal thee. The element body includes a first portion and a pair of second portions. The first portion is covered by the external electrodes. The pair of second portions are located on both sides or the first portion and separated from the interposer. A width in a second direction of the pair of external electrodes is smaller than a width in the second direction of the element body and larger than a width in the second direction of the second portion.

Abstract: An electronic component includes a multilayer capacitor and an interposer. The multilayer capacitor includes an element body and a pair of external electrodes. The interposer includes a substrate having first and second principal faces, a pair of first electrodes disposed on the first principal face, and a pair of second electrodes disposed on the second principal face so as to be separated from the pair of first electrodes in a first direction or in a second direction. Widths of the pair of external electrodes and the pair of first electrodes are smaller than a width of the element body. The element body has a first portion covered by the external electrode, and a pair of second portions located on both sides of the first portion. The pair of second portions are separated from the interposer and overlap the pair of second electrodes when viewed from a third direction.

Abstract: An interposer includes a plurality of first connection electrodes each of which is arranged on either of first- and second-side-surface sides of a first principal surface of a substrate; a plurality of second connection electrodes each of which is arranged on either of first- and second-side-surface sides of a second principal surface of the substrate; and a plurality of third connection electrodes each of which is arranged on either of first and second side surfaces. Each of the first connection electrodes has a first portion located away from an edge of the first principal surface, and a second portion extending from the first portion to the edge and connected to the third connection electrode. Each of the second portion of each first connection electrode and the plurality of third connection electrodes has a width smaller than a width of the first portion of each first connection electrode.

Abstract: Dielectric particles including a main component including barium titanate and R oxide (where R is at least one element selected from Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu), wherein when defining the size of the dielectric particles as “D” and defining the region of a depth from the particle surface of 0% to 10% of said D as a surface region, a region of a depth from the particle surface of more than 10% to less than 40% of the D as an intermediate region, and a region of a depth from the particle surface of 40% to 50% of the D as a center region, in the surface region, the ratio of content of the R oxide decreases from the surface side toward the center of the dielectric particles and in the center region, the ratio of content of the R oxide increases from the surface side toward the center of the dielectric particles.

Abstract: An object of the present invention is to provide a method of production of a multilayer ceramic electronic device able to prevent the multilayer ceramic electronic device from dropping in mechanical strength and causing structural defects such as cracks at a low cost even if annealing the sintered body for reoxidation, and also such a multilayer ceramic electronic device, i.e., a method of production of a multilayer ceramic electronic device including a step of stacking green sheets and internal electrode layers to obtain a green chip, a step of firing the green chip under a reducing atmosphere to obtain a sintered body, and a reoxidation step of annealing the sintered body in a predetermined annealing atmosphere gas, wherein the annealing atmosphere gas in the reoxidation step has a dew point of ?50 to 0° C., and the annealing atmosphere gas in the reoxidation step has a temperature of 900 to 1100° C.