Patents by Inventor Tomoyoshi Hirabayashi

Tomoyoshi Hirabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100786
    Abstract: A roller unit aligns tapes in a width direction and feeds the tapes in a length direction while pressing the tapes in a thickness direction. The tapes are made of fibers which have not been impregnated with resin or have been impregnated with the resin. The roller unit includes rollers and a support shaft. The rollers rotate by friction force between the tapes and the rollers. The rollers are aligned so that rotation axes lie on a same straight line. Maximum diameters of the rollers are same as each other. The support shaft supports the rollers rotatably at rotational speeds independent from each other. Each of the rollers includes springs and thereby has elasticity. Length directions of the springs as well as expansion and contraction directions of the springs are radial directions of the each of the rollers. The springs are radially disposed inside the each of the rollers.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 28, 2024
    Applicant: SUBARU CORPORATION
    Inventors: Daisuke HIRABAYASHI, Daichi TERAYAMA, Shunya NAKANISHI, Tomoyoshi KUNIYA, Masami KOMANIWA, Shunsuke UENO
  • Publication number: 20240100785
    Abstract: A roller unit aligns tapes in a width direction and feeds the aligned tapes. The tapes are made of fibers which have not been impregnated with resin or have been impregnated with the resin. The roller unit includes rollers and a support shaft. The rollers rotate by friction force between the tapes and the rollers when the rollers contact with the tapes. The rollers are aligned so that rotation axes of the rollers lie on a same straight line. Diameters of the rollers are same as each other. The support shaft supports the rollers rotatably at rotational speeds independent from each other.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 28, 2024
    Applicant: SUBARU CORPORATION
    Inventors: Daichi TERAYAMA, Tomoyoshi KUNIYA, Daisuke HIRABAYASHI
  • Patent number: 11571901
    Abstract: A printing device to which a predetermined flat-rate usage fee is applied regardless of the number of times a cartridge is replaced includes an ejection head having a nozzle capable of ejecting a liquid stored in each of a plurality of cartridges, and a controller, wherein the controller includes a cleaning execution unit that executes a cleaning process and wherein the cleaning process includes a determination process of determining the presence or absence of a specific cartridge, among a plurality of cartridges, whose liquid remaining amount is equal to or greater than a reference remaining amount before performing the cleaning operation, and whose liquid remaining amount is expected to be less than the reference remaining amount when the cleaning operation is executed, and a setting process of setting the specific cartridge as a cartridge to be replaced before executing the cleaning operation.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: February 7, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Tomoyoshi Hirabayashi
  • Publication number: 20220176701
    Abstract: A printing device to which a predetermined flat-rate usage fee is applied regardless of the number of times a cartridge is replaced includes an ejection head having a nozzle capable of ejecting a liquid stored in each of a plurality of cartridges, and a controller, wherein the controller includes a cleaning execution unit that executes a cleaning process and wherein the cleaning process includes a determination process of determining the presence or absence of a specific cartridge, among a plurality of cartridges, whose liquid remaining amount is equal to or greater than a reference remaining amount before performing the cleaning operation, and whose liquid remaining amount is expected to be less than the reference remaining amount when the cleaning operation is executed, and a setting process of setting the specific cartridge as a cartridge to be replaced before executing the cleaning operation.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 9, 2022
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Tomoyoshi HIRABAYASHI
  • Patent number: 11279134
    Abstract: A liquid ejection apparatus includes a liquid ejection head configured to eject liquid from a plurality of nozzles to a medium and a plurality of caps configured to cover a plurality of nozzle groups. The plurality of caps includes a first cap group covering a first nozzle group positioned near the center of the liquid ejection head among the plurality of nozzle groups and a second cap group and a third cap group provided at positions sandwiching the first cap group in the width direction. The liquid ejection head is configured to execute a first idle ejection for ejecting liquid from the plurality of nozzles constituting the plurality of nozzle groups to the plurality of caps and a second idle ejection for ejecting the liquid from the plurality of nozzles constituting the second nozzle group and the third nozzle group to the second cap group and the third cap group.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: March 22, 2022
    Assignee: Seiko Epson Corporation
    Inventors: Masaru Kobashi, Tomoyoshi Hirabayashi
  • Patent number: 11137955
    Abstract: A server apparatus includes a receiving section that receives first apparatus information and associated information in association with each other, a storage section that stores second apparatus information and user information in association with each other, a control section that determines an execution condition based on the associated information received by the receiving section, and a transmitting section that transmits, to a printing apparatus, the execution condition determined by the control section. The control section causes the execution condition thus determined and the user information associated with the second apparatus information that matches the first apparatus information to be stored in the storage section in association with each other. The transmitting section transmits, to the printing apparatus having the first apparatus information that matches the second apparatus information associated with the user information, the execution condition associated with the user information.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: October 5, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Tomoyoshi Hirabayashi, Ryo Oguchi, Tokio Kato, Tomoya Kurashina
  • Publication number: 20210208825
    Abstract: A server apparatus includes a receiving section that receives first apparatus information and associated information in association with each other, a storage section that stores second apparatus information and user information in association with each other, a control section that determines an execution condition based on the associated information received by the receiving section, and a transmitting section that transmits, to a printing apparatus, the execution condition determined by the control section. The control section causes the execution condition thus determined and the user information associated with the second apparatus information that matches the first apparatus information to be stored in the storage section in association with each other. The transmitting section transmits, to the printing apparatus having the first apparatus information that matches the second apparatus information associated with the user information, the execution condition associated with the user information.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 8, 2021
    Inventors: Tomoyoshi HIRABAYASHI, Ryo OGUCHI, Tokio KATO, Tomoya KURASHINA
  • Publication number: 20200406621
    Abstract: A liquid ejection apparatus includes a liquid ejection head configured to eject liquid from a plurality of nozzles to a medium and a plurality of caps configured to cover a plurality of nozzle groups. The plurality of caps includes a first cap group covering a first nozzle group positioned near the center of the liquid ejection head among the plurality of nozzle groups and a second cap group and a third cap group provided at positions sandwiching the first cap group in the width direction. The liquid ejection head is configured to execute a first idle ejection for ejecting liquid from the plurality of nozzles constituting the plurality of nozzle groups to the plurality of caps and a second idle ejection for ejecting the liquid from the plurality of nozzles constituting the second nozzle group and the third nozzle group to the second cap group and the third cap group.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 31, 2020
    Inventors: Masaru KOBASHI, Tomoyoshi HIRABAYASHI
  • Patent number: 9401320
    Abstract: A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: July 26, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Tomoya Daizo, Takema Adachi, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa, Tomoyoshi Hirabayashi
  • Publication number: 20160014898
    Abstract: A printed wiring board includes a first circuit substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first circuit substrate and that the second pads are positioned to electrically connect the first circuit substrate to a second circuit substrate, and metal posts including plating material and formed on the second pads respectively such that the metal posts are positioned to mount the second circuit substrate on the first circuit substrate. Each of the metal posts has a height h1 and a thickness b such that the metal posts have a value h1/b which is greater than 0.1 and smaller than 1.0 where the value h1/b is obtained by dividing the height h1 by the thickness b.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 14, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Wataru Nakamura, Tomoyoshi Hirabayashi
  • Publication number: 20150255433
    Abstract: A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Tomoya DAIZO, Takema Adachi, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa, Tomoyoshi Hirabayashi