Patents by Inventor Tomoyoshi Tajiri

Tomoyoshi Tajiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode array and method of forming the same
    Patent number: 6342402
    Abstract: A light emitting diode array includes a light emitting area formed on a semiconductor substrate, a diffusion prevention layer formed on the semiconductor substrate, and an insulating layer formed on the diffusion prevention layer. The diffusion prevention layer has a lower edge and the insulating layer has a level drop at this lower edge. An interconnection conductor extends on the insulating layer and is in ohmic contact with the light emitting region through holes in the insulating layer and the diffusion prevention layer. The interconnection conductor has a stepped portion at the level drop of the insulating layer, the stepped portion being located in a wide-width segment of the interconnection conductor.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: January 29, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tomoyoshi Tajiri, Takao Kusano, Kazuya Ohkawa
  • Light emitting diode array with contact geometry
    Patent number: 6054723
    Abstract: A light emitting diode array includes a light emitting area formed on a semiconductor substrate, a diffusion prevention layer formed on the semiconductor substrate, and an insulating layer formed on the diffusion prevention layer. The diffusion prevention layer has a lower edge and the insulating layer has a level drop at this lower edge. An interconnection conductor extends on the insulating layer and is in ohmic contact with the light emitting region through holes in the insulating layer and the diffusion prevention layer. The interconnection conductor has a stepped portion at the level drop of the insulating layer, the stepped portion being located in a wide-width segment of the interconnection conductor.
    Type: Grant
    Filed: November 21, 1996
    Date of Patent: April 25, 2000
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tomoyoshi Tajiri, Takao Kusano, Kazuya Ohkawa