Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.

Abstract: An IC socket with good durability that permits electrical tests on the IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing means 54 and the bump 21 of the IC 10 flexibly deforms the spring means S via the insulative resin film 3, a contact pressure due to the elastic force of the spring means S occurs in the contact area between the bump 21 and contact pad 11.

Abstract: An IC socket with good durability that permits electrical tests on IC to be performed accurately over a long period of time is provided. An elastically deformable metal plate 12 is fixed within a spring accommodating portion 9 of a support board 2. The metal plate 12 is such that a plurality of spiral cantilevers 19 are formed so as to correspond to bumps 21 of the IC 10, and the flat tip 19a of the spiral cantilever supports an insulative resin film 3. When the IC 10 is pressed by an IC pressing part 54 and the bump 21 of the IC 10 flexibly deforms the spring part S via the insulative resin film 3, a contact pressure due to the elastic force of the spring part S occurs in the contact area between the bump 21 and contact pad 11.

Abstract: A pad cover of a size capable of containing two pads in parallel, wherein a partitioning wall is provided in said cover to traverse the center thereof, short side walls of cover are formed to which the ends of said partitioning wall are fastened, and openings are formed starting from both sides of said short side walls running through the ends of the two sides.Owing to the presence of the partitioning walls, the two pads can be easily pulled out or inserted through the openings.

Abstract: The present invention provides a sleeping mattress comprising:an upper cushion member provided with a plurality of undulated projections and a plurality of through-holes;a core member which is disposed under said upper cushion member while provided with a plurality of concave portions serving as reinforcing ribs together with a plurality of semi-spherical elements received in said through-holes of said upper cushion member, said semi-spherical elements being provided in an upper surface of said core member; anda lower cushion member a peripheral edge portion of which is fixed to a peripheral edge portion of said upper cushion member so that said core member is interposed between said upper cushion member and said lower cushion member.The reinforcing ribs are formed in the core member when the core member is produce through a compression molding process. The ribs serve to hold the shape of the sleeping mattress.

Abstract: A method for fixing a plurality of permanent magnets to an inner cover of bedclothing such as a comforter filled with down and the like comprises the steps of: providing a patch assuming a suitable shape such as a circular shape and the like; applying a bonding-agent sheet to the patch; fixing temporarily a permanent magnet to a center of the bonding-agent sheet to prepare an assembly consisting of the patch, the bonding-agent sheet and the permanent magnet; placing the assembly on a cover of bedclothing in a condition in which the permanent magnet of the assembly abuts on the cover of bedclothing; placing a platen having a hole for receiving the permanent magnet of the assembly therein on the assembly; heating the platen to melt the bonding-agent sheet of the assembly so as to bond the path of the assembly to the cover of bedclothing.

Abstract: In order to construct an IC-tester socket as a whole into a compact size and to make the mounting and removal of an IC package easy and further to enable stable and positive contact between the lead terminals of the IC package and contact pins, the IC-tester socket is comprised of a socket body capable of accomodating an IC package; a plurality of contact pins provided within the socket body and each having resilient first and second arms capable, in their normal state, of nipping each said lead terminal; and releasers mounted vertically movably on the socket body for being able to release the nipping of the lead terminals done by these first and second arms.