Abstract: This manufacturing method of a metal component enables precision processing of a corner portion, and the radius of curvature of a cog tip of a gear and the like can be made smaller than before. The manufacturing method of a metal component includes: (a) forming a mask film having, in plan view, a first side, a second side, and an extension portion that extends from a region between the first side and the second side on a metal film; and (b) forming a corner portion having, in plan view, a third side and a fourth side by etching the metal film.

Abstract: This manufacturing method of a metal component enables precision processing of a corner portion, and the radius of curvature of a cog tip of a gear and the like can be made smaller than before. The manufacturing method of a metal component includes: (a) forming a mask film having, in plan view, a first side, a second side, and an extension portion that extends from a region between the first side and the second side on a metal film; and (b) forming a corner portion having, in plan view, a third side and a fourth side by etching the metal film.

Abstract: A method for manufacturing a semiconductor device including: fixing each of a plurality of semiconductor substrates onto a surface of a wiring substrate in which a perforation is formed in advance; covering the surface of the wiring substrate with a metal mold having a protrusion on an inner surface along the perforation; wholly sealing the plurality of semiconductor substrates with a sealing resin by introducing the sealing resin into the metal mold while forming a thin region in the sealing resin along the perforation; and dividing the wiring substrate into a plurality of chips by splitting the wiring substrate and the sealing resin along the perforation in the wiring substrate and the thin region in the sealing resin.

Abstract: A method of manufacturing a semiconductor device, comprises; fixing a plurality of semiconductor substrates to a surface of a wiring substrate in which a perforated line, a grooved portion or grooved portion like the a perforated line is formed in advance; splitting the wiring substrate into a plurality of pieces by breaking the wiring substrate along the perforated line, a grooved portion or grooved portion like the a perforated line. A semiconductor device comprises; a semiconductor substrate; a wiring substrate where the semiconductor substrate is fixed and coupled; and at least one side of the wiring substrate which is formed by breaking the wiring substrate along a perforated line, a grooved portion or grooved portion like the a perforated line.