Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.

Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.

Abstract: A copper metal film having 105 to 109 micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a completing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond.

Abstract: A printed circuit board comprising a metal copper film having 105 to 109 micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.

Abstract: An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.