Abstract: An X-ray analyzing apparatus is such that a diffraction pattern, in which the intensity of secondary X-rays (4) is associated with the angle of rotation of a sample (S), is stored; while the pattern is scanned by a line of the secondary X-rays (4) intensity in a direction of highness and lowness, points on the pattern having not higher intensity than the line are taken as candidate points; respective angles of rotation of the candidate points, when the maximum value of the difference in angle of rotation between the neighboring candidate points attains a predetermined angle, are stored; depending on coordinates of a point of measurement, the angle of rotation proximate to the coordinates is read out from the stored angles; and the sample (S) is set to the read out angle and the point of measurement is arranged within the field of view (V) of a detector (7).

Abstract: An X-ray analyzing apparatus is such that a diffraction pattern, in which the intensity of secondary X-rays (4) is associated with the angle of rotation of a sample (S), is stored; while the pattern is scanned by a line of the secondary X-rays (4) intensity in a direction of highness and lowness, points on the pattern having not higher intensity than the line are taken as candidate points; respective angles of rotation of the candidate points, when the maximum value of the difference in angle of rotation between the neighboring candidate points attains a predetermined angle, are stored; depending on coordinates of a point of measurement, the angle of rotation proximate to the coordinates is read out from the stored angles; and the sample (S) is set to the read out angle and the point of measurement is arranged within the field of view (V) of a detector (7).

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A flat light source apparatus has a light source board which comprises unit boards, each unit board having a printed circuit board and a light source formed on the printed circuit board, wherein the unit boards are arranged adjacent to each other at least in one direction, and any pair of the unit boards adjacent to each other is integrated by a connecting portion provided therebetween. The apparatus also has a main wire which extends along a plane of the light source board, wherein the main wire extends between adjacent unit boards via the connecting portion such that all of the unit boards are electrically connected to each other by the main wire. The apparatus further has a branch wire for supplying electric power to the light source, the branch wire being provided in each unit board and branching from the main wire in each unit board.

Abstract: A circuit configuration for realizing high impedance in an address drive circuit is provided in order to reduce the number of recovery switches without reducing power recovery efficiency. A mechanism for realizing the high impedance in an address drive circuit during a sustain period of a plasma display panel is provided. By achieving the high impedance, capacitance coupling between an X electrode and an address electrode and between a Y electrode and an address electrode can be cancelled, and a power recovery circuit can be simplified without reducing the power recovery efficiency.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

Abstract: [Problems to be Solved] In technology for identifying the position of an indoor terminal with high accuracy, the cost for installing a transmitter is high for the introduction of the position identifying technique which uses a transmitter to send a weak electric wave such as in Bluetooth, RFID, and the like, or an emitter to emit an infrared ray. [Means to Solve the Problems] Power is acquired from the existing lighting equipment to operate the transmitter which sends a weak electric wave such as in Bluetooth, RFID, and the like, or an emitter which emits an infrared ray.

Abstract: A reduced size LED lamp includes: a cap of the type GX53 that meets IEC standards; a substrate attached to the cap, which an LED is mounted on; and a light emitting surface cover case attached to the cap so as to cover the substrate.

Abstract: A circuit configuration for realizing high impedance in an address drive circuit is provided in order to reduce the number of recovery switches without reducing power recovery efficiency. A mechanism for realizing the high impedance in an address drive circuit during a sustain period of a plasma display panel is provided. By achieving the high impedance, capacitance coupling between an X electrode and an address electrode and between a Y electrode and an address electrode can be cancelled, and a power recovery circuit can be simplified without reducing the power recovery efficiency.

Abstract: Many different key data items can be prepared even if the memory capacity of a key data setting unit incorporated in a content decryption unit. Partial content data items to be successively read are stored in an accumulation medium, encrypted with corresponding key data items. There are provided a key data table which stores the key data items, a read processing section for reading, from the accumulation medium, the partial content data items, a decryption unit for decrypting the read partial content data items, and a set-key selection section for reading, from the key data table, a key data item for decrypting a partial content data item to be decrypted, and a key data item for decrypting a partial content data item to be processed next at least, the set-key selection section also setting the read key data items in the decryption unit.

Abstract: According to one embodiment, a clock generating unit configured to generate a clock having a predetermined frequency, an input value generating unit configured to generate an input value for predetermined encryption algorithm based on a generated clock, and a calculation processing unit configured to generate random number data by executing the encryption algorithm based on a generated input value are integrated, and a clock and an input value are enclosed inside the integrated circuit so as to be unobservable from the outside of the integrated circuit.

Abstract: A flat light source apparatus has a light source board which comprises unit boards, each unit board having a printed circuit board and a light source formed on the printed circuit board, wherein the unit boards are arranged adjacent to each other at least in one direction, and any pair of the unit boards adjacent to each other is integrated by a connecting portion provided therebetween. The apparatus also has a main wire which extends along a plane of the light source board, wherein the main wire extends between adjacent unit boards via the connecting portion such that all of the unit boards are electrically connected to each other by the main wire. The apparatus further has a branch wire for supplying electric power to the light source, the branch wire being provided in each unit board and branching from the main wire in each unit board.

Abstract: The present invention determines whether received operation information is addressed to its own apparatus and, if such is the case, executes processing based on a command included in the operation information and, otherwise, packetizes the operation information and outputs it to a network.

Abstract: A conductive electrode pad is formed on a partial area of an insulating surface. An insulating film covers the electrode pad. The insulating film has an opening exposing at least a partial upper surface of the electrode pad. A barrier layer of conductive material is formed on the partial upper surface exposed on the bottom of the opening and on the surface of the insulating film near the opening. A conductive bump is adhered to the barrier layer. A step is formed on the surface of a layer under the barrier layer between an outer periphery of the barrier layer and an outer periphery of the opening.