Abstract: The present invention is to provide an intelligent pluggable transceiver improving EMI tolerance with a simple mechanism. The optical transceiver of the invention includes upper and lower housings, a holder, optical assemblies, a cover, a substrate and a grip. The optical assemblies are fixed with the upper and lower housings together with the holder by interposing a conductive elastic member. Although the rear end of the substrate is exposed outside of the transceiver, the shield gasket and the ground pattern on the substrate shield the contact portion between the substrate and the upper housing, and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: The present invention provides a semiconductor laser module in which parasitic inductance due to the bonding wire is removed, accordingly, the high frequency performance thereof can be enhanced. The laser module of the present invention has a sub-mount, on which the semiconductor laser diode is installed and transmission lines for supplying the signal to the laser diode is formed. The transmission lines on the sub-mount are directly connected to corresponding lead pins provided in the base of the package without any bonding wires. Between the lead pins and under the sub-mount is provided a photo diode for monitoring light emitted from the laser diode.

Abstract: The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield gasket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: The present invention is to provide an intelligent pluggable transceiver improving an EMI tolerance with a simple mechanism. The optical transceiver of the invention comprises upper and lower housings (11, 12), a holder (81), optical assemblies (51, 61), a cover (14), a substrate (15) and a grip (13). The optical assemblies are fixed with the upper and lower housings together with the holder with interposing the conductive elastic member. Although the rear end of the substrate exposes outside the transceiver, the shield gasket and the ground pattern on the substrate shields the contact portion between the substrate and the upper housing and between the substrate and the cover. Moreover, the grip and the latch lever installed in the lower housing, and the elastic piece realize the latching/releasing mechanism of the transceiver with the host system.

Abstract: The present invention reduces the radiation noise and the degradation of the optical waveform appeared in the output of the laser module. The laser module of the present invention comprises the laser diode, the photodiode, and the resistor, which are mounted on the stem of the laser module. The stem includes four lead terminals, one of which is commonly connected to the laser diode ad the photodiode via the resistor. Therefore, the leak of the modulation current applied to the lead terminal, to which the laser diode and the photodiode are commonly connected, may be reduced.

Abstract: A semiconductor laser module has a stem base and a stem block provided thereon. A submount is fixed on the block, and a laser diode (LD) is mounted on the submount. Transmission lines are formed on the submount and connected to the anode and cathode of the LD. Lead pins extend through the stem base to be connected to the transmission lines. A photodetector is disposed, below the LD, on the stem base. Aperture for placement of the photodetector is formed in the submount, and the photodetector is placed at least partially in this aperture.

Abstract: The present invention provides a semiconductor laser module in which parasitic inductance due to the bonding wire is removed, accordingly, the high frequency performance thereof can be enhanced. The laser module of the present invention has a sub-mount, on which the semiconductor laser diode is installed and transmission lines for supplying the signal to the laser diode is formed. The transmission lines on the sub-mount are directly connected to corresponding lead pins provided in the base of the package without any bonding wires. Between the lead pins and under the sub-mount is provided a photo diode for monitoring light emitted from the laser diode.

Abstract: A semiconductor laser module has a stem base and a stem block provided thereon. A submount is fixed on the block, and a laser diode (LD) is mounted on the submount. Transmission lines are formed on the submount and connected to the anode and cathode of the LD. Lead pins extend through the stem base to be connected to the transmission lines. A photodetector is disposed, below the LD, on the stem base. Aperture for placement of the photodetector is formed in the submount, and the photodetector is placed at least partially in this aperture.