Patents by Inventor Tomoyuki Hakata

Tomoyuki Hakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240040749
    Abstract: A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.
    Type: Application
    Filed: September 2, 2021
    Publication date: February 1, 2024
    Inventors: Junya MISHIMA, Tomoyuki HAKATA
  • Patent number: 10632517
    Abstract: Provided is a crimp structure in which an inner member and an outer member that is arranged outside the inner member are joined to each other. The inner member includes: an insertion portion having a columnar surface-like outer circumferential surface; and a recessed portion provided in the outer circumferential surface. The outer member includes: a cylindrical portion that forms an opening into which the insertion portion is inserted; a reduced-diameter portion that is formed in the cylindrical portion, and has a plastically deformed shape such that a diameter of the cylindrical portion is reduced annularly inward in a radial direction; and a protruding portion that has a plastically deformed shape such that a part, in a circumferential direction, of the reduced-diameter portion has entered the recessed portion. Relative rotation of the inner member and the outer member can be suppressed.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: April 28, 2020
    Assignee: OMRON Corporation
    Inventors: Eiji Teramoto, Tomoyuki Hakata, Hitoshi Nakano, Kazuyoshi Nishikawa
  • Patent number: 10471660
    Abstract: A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: November 12, 2019
    Assignee: OMRON Corporation
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata
  • Patent number: 10449698
    Abstract: A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: October 22, 2019
    Assignee: OMRON CORPORATION
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata, Hiroshige Uematsu
  • Publication number: 20180207847
    Abstract: Provided is a production method for a bonded structure (100, 200) in which a first member (10, 10a, 10b, 10c, 10d, 30) and a second member (20) are bonded. The production method is provided with: a step for forming perforations (11, 11b, 11c, 11d, 31) with an opening in the surface (13) of the first member (10, 10a, 10b, 10c, 10d, 30) by irradiating the surface (13) of the first member (10, 10a, 10b, 10c, 10d, 30) with a laser in which one pulse is configured from a plurality of sub-pulses; and a step for filling and curing the second member (20) in the perforations (11, 11b, 11c, 11d, 31) of the first member (10, 10a, 10b, 10c, 10d, 30).
    Type: Application
    Filed: August 17, 2015
    Publication date: July 26, 2018
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA
  • Publication number: 20170352470
    Abstract: A transformer includes a stacked structure in which a plurality of coils is stacked through insulation layers. The stacked structure includes: a primary coil stacked layer including a plurality of primary coil layers connected in parallel with one another; and a secondary coil stacked layer including a plurality of secondary coil layers connected in parallel with one another. One of the primary coil layers is disposed as an outermost layer in the stacked structure, and another is disposed between at least two layers of the plurality of secondary coil layers. The primary coil layer includes a plurality of primary coils connected in parallel with one another. The secondary coil layer includes one or more secondary coils thicker than the primary coil.
    Type: Application
    Filed: March 10, 2017
    Publication date: December 7, 2017
    Applicants: OMRON AUTOMOTIVE ELECTRONICS CO., LTD., OMRON Corporation
    Inventors: Masahiro Yamagami, Noriyoshi Omote, Tomoyuki Hakata, Masaya Fukuda, Akio Sumiya
  • Patent number: 9793637
    Abstract: Provided is a crimp structure in which an inner member and an outer member are joined to each other. The inner member includes an insertion portion having a columnar outer circumferential surface, and an annular groove provided in the outer circumferential surface. The outer member includes a main body portion, and a cylindrical portion continuous with the main body portion and forming an opening into which the insertion portion is inserted. The cylindrical portion includes a first reduced-diameter portion continuous with the main body portion via a first plastically-deformed portion and located further inward in a radial direction than the main body portion, and a second reduced-diameter portion continuous with the first reduced-diameter portion via a second plastically-deformed portion and located further inward in the radial direction than the first reduced-diameter portion. At least a part of the second reduced-diameter portion has entered the annular groove.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: October 17, 2017
    Assignee: OMRON Corporation
    Inventors: Eiji Teramoto, Tomoyuki Hakata, Hitoshi Nakano, Kazuyoshi Nishikawa
  • Publication number: 20170259468
    Abstract: A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.
    Type: Application
    Filed: August 17, 2015
    Publication date: September 14, 2017
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA, Hiroshige UEMATSU
  • Publication number: 20170210058
    Abstract: A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.
    Type: Application
    Filed: August 17, 2015
    Publication date: July 27, 2017
    Applicant: OMRON Corporation
    Inventors: Kazuyoshi NISHIKAWA, Akio SUMIYA, Satoshi HIRONO, Tomoyuki HAKATA
  • Publication number: 20170120321
    Abstract: Provided is a crimp structure in which an inner member and an outer member that is arranged outside the inner member are joined to each other. The inner member includes: an insertion portion having a columnar surface-like outer circumferential surface; and a recessed portion provided in the outer circumferential surface. The outer member includes: a cylindrical portion that forms an opening into which the insertion portion is inserted; a reduced-diameter portion that is formed in the cylindrical portion, and has a plastically deformed shape such that a diameter of the cylindrical portion is reduced annularly inward in a radial direction; and a protruding portion that has a plastically deformed shape such that a part, in a circumferential direction, of the reduced-diameter portion has entered the recessed portion. Relative rotation of the inner member and the outer member can be suppressed.
    Type: Application
    Filed: February 16, 2015
    Publication date: May 4, 2017
    Applicant: OMRON Corporation
    Inventors: Eiji TERAMOTO, Tomoyuki HAKATA, Hitoshi NAKANO, Kazuyoshi NISHIKAWA
  • Publication number: 20170098905
    Abstract: Provided is a crimp structure in which an inner member and an outer member are joined to each other. The inner member includes an insertion portion having a columnar outer circumferential surface, and an annular groove provided in the outer circumferential surface. The outer member includes a main body portion, and a cylindrical portion continuous with the main body portion and forming an opening into which the insertion portion is inserted. The cylindrical portion includes a first reduced-diameter portion continuous with the main body portion via a first plastically-deformed portion and located further inward in a radial direction than the main body portion, and a second reduced-diameter portion continuous with the first reduced-diameter portion via a second plastically-deformed portion and located further inward in the radial direction than the first reduced-diameter portion. At least a part of the second reduced-diameter portion has entered the annular groove.
    Type: Application
    Filed: February 16, 2015
    Publication date: April 6, 2017
    Applicant: OMRON Corporation
    Inventors: Eiji TERAMOTO, Tomoyuki HAKATA, Hitoshi NAKANO, Kazuyoshi NISHIKAWA
  • Publication number: 20160052202
    Abstract: A joined structure has a first member, a second member that is joined together with the first member, and a pore portion formed on the first member and having an opening in a surface of the first member. The pore portion is filled with the second member. The pore portion has an inwardly extending protrusion on an inner periphery thereof.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 25, 2016
    Applicant: OMRON CORPORATION
    Inventors: Kazuyoshi Nishikawa, Akio Sumiya, Satoshi Hirono, Tomoyuki Hakata, Hiroshige Uematsu, Kazuhiro Ijiri