Abstract: A method for manufacturing a mirror device is a method for manufacturing a mirror device including a structural body that includes a support portion, a movable portion, and a coupling portion, and a mirror layer provided on the movable portion. The method for manufacturing a mirror device includes: a first forming step of forming a plurality of parts on a wafer, each of the plurality of parts corresponding to the structural body; a second forming step of forming the mirror layer on a part of each of the plurality of parts, the part corresponding to the movable portion; a heating step of heating the part of each of the plurality of parts, corresponding to the movable portion, after the first forming step and the second forming step; and a cutting step of cutting the wafer to separate the plurality of parts from one another, after the heating step.

Abstract: A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.

Abstract: An optical module includes a mirror unit, a magnet unit, and a package including a recess. The magnet unit includes a first magnet and a second magnet. The recess includes a base wall portion to which an upper surface of the magnet unit is fixed, and a side wall portion facing a side surface of the magnet unit. The mirror unit is disposed on a second surface on an opposite side of the base wall portion from a first surface to which the magnet unit is fixed. A second upper surface of the second magnet is located closer to the lower side than a first upper surface of the first magnet. The magnet unit is fixed to the base wall portion by an adhesive material disposed at least between the first surface of the base wall portion and the second upper surface of the second magnet.

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer and a device layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer and the device layer from the wafer by etching and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning for cleaning the wafer using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a circulation hole penetrating the wafer is formed at a part other than the slit in the wafer by the etching.

Abstract: A mirror unit includes a light scanning device and a package. The package has a main body portion provided with a light incident opening that opens on one side in a predetermined direction, a protrusion provided on a top surface of the main body portion, and a flat plate-shaped window member disposed on the top surface on an inward side of the protrusion and covering the light incident opening. An end surface of the protrusion on the one side is positioned more to the one side than the window member. A thickness of the protrusion is smaller than a height of the protrusion from the top surface. When viewed in any direction perpendicular to the predetermined direction, a length of a part covered by the protrusion in the window member is longer than a length of a part exposed from the protrusion in the window member.

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer, a device layer, and an intermediate layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a part of the intermediate layer is removed from the wafer by anisotropic etching.

Abstract: A mirror unit includes an optical scanning device, a frame member, and a window member. The frame member includes first and second wall portions facing each other in an X-axis direction. The first wall portion is higher than the second wall portion. The window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface of the optical scanning device. In a cross-section parallel to the X-axis direction, the first wall portion is separated from a first line passing through a first end at a side of the first wall portion in the mirror surface and a first corner portion formed at the side of the first wall portion by an outer surface opposite to the frame member and a first side surface in the window member.

Abstract: In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.

Abstract: A mirror apparatus includes a base portion; a mirror unit; a frame member; and a window member. The frame member includes a first wall portion, a second wall portion, and a pair of standing wall portions. The window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion, and is inclined with respect to a mirror surface. A top surface of each of the pair of standing wall portions includes a flat portion. A width of the top surface and a width of a bottom surface of each of the pair of standing wall portions are wider than a width of the first wall portion and a width of the second wall portion. At least a part of the bottom surface of each of the pair of standing wall portions is in contact with the base portion.

Abstract: A mirror apparatus includes a base portion formed with a recess that is open to a disposition surface; a magnet unit disposed in the recess; a mirror unit having a mirror surface; a frame member disposed on the disposition surface at a second surface of the frame member; and a window member. The window member is inclined with respect to the mirror surface. A projection portion is formed on the second surface of the frame member. The projection portion is disposed between the magnet unit and an opening edge of the recess when viewed in a Z direction. A portion of a first surface of the frame member, which overlaps the projection portion in the Z direction, is an inclined surface inclined with respect to the mirror surface, and the window member is disposed on the inclined surface.

Abstract: An actuator device includes: a first movable portion; a second movable portion; a magnet portion; a coil; and a controller configured to supply a first drive signal for resonantly driving the first movable portion and a second drive signal for non-resonantly driving the second movable portion to the coil. An abnormality detection method includes: supplying the second drive signal to the coil by the controller; acquiring an output value corresponding to a counter electromotive force generated in the coil while the second drive signal is supplied to the coil; and determining whether an abnormality has occurred in a tilted state of the second movable portion on the basis of the second drive signal supplied to the coil and the acquired output value.

Abstract: A mirror device includes a support portion; a first movable portion including a body portion including a first surface and a second surface opposite to the first surface, a mirror surface being formed on the first surface and a rib portion being formed on the second surface; and a first torsion bar that couples the first movable portion to the support portion such that the first movable portion is swingable around an X-axis. The rib portion includes a first extending portion extending along an outer edge of the body portion when viewed in a direction perpendicular to the second surface. The first extending portion includes a protrusion portion protruding outward from the outer edge of the body portion and extending along the outer edge of the body portion when viewed in the direction perpendicular to the second surface.

Abstract: In a mirror device, a first rib portion includes a pair of first portions extending toward one side in a first direction and a first extending portion extending between the first portions. A second rib portion includes a pair of second portions extending toward the other side in the first direction and a second extending portion extending between the second portions. A third rib portion includes a pair of third portions extending toward one side in a second direction. A fourth rib portion includes a pair of fourth portions extending toward the other side in the second direction. A rib portion does not include portions formed between the third portions and between the fourth portions and extending to intersect the second axis when viewed in a third direction. The first to fourth portions are portions different from one another.

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer, a device layer, and an intermediate layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer, the device layer, and the intermediate layer from the wafer and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a part of the intermediate layer is removed from the wafer by anisotropic etching.

Abstract: In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.

Abstract: A method for manufacturing a mirror device, the method includes a first step of preparing a wafer having a support layer and a device layer; a second step of forming a slit in the wafer such that the movable portion becomes movable with respect to the base portion by removing a part of each of the support layer and the device layer from the wafer by etching and forming a plurality of parts each corresponding to the structure in the wafer, after the first step; a third step of performing wet cleaning for cleaning the wafer using a cleaning liquid after the second step; and a fourth step of cutting out each of the plurality of parts from the wafer after the third step. In the second step, a circulation hole penetrating the wafer is formed at a part other than the slit in the wafer by the etching.

Abstract: A mirror unit includes an optical scanning device, a frame member, and a window member. The frame member includes first and second wall portions facing each other in an X-axis direction. The first wall portion is higher than the second wall portion. The window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface of the optical scanning device. In a cross-section parallel to the X-axis direction, the first wall portion is separated from a first line passing through a first end at a side of the first wall portion in the mirror surface and a first corner portion formed at the side of the first wall portion by an outer surface opposite to the frame member and a first side surface in the window member.

Abstract: An optical module includes: a mirror unit including a mirror device including a movable mirror portion provided with a coil; and a magnet unit including a first magnet, a second magnet, and a third magnet arranged along a first direction, and generating a magnetic field acting on the movable mirror portion. The mirror unit is disposed on the magnet unit in a second direction perpendicular to the first direction, and has a bottom surface facing the magnet unit. A protrusion portion protruding to a magnet unit side is formed on the bottom surface. A width of the protrusion portion in the first direction is equal to or less than a width of the first magnet in the first direction. The mirror unit is fixed to an upper surface of the first magnet at the protrusion portion.

Abstract: An optical module includes: a mirror unit; and a magnet unit including first, second, and third magnets arranged along a first direction. The mirror unit is disposed on the magnet unit in a second direction perpendicular to the first direction. A width of the first magnet is equal to or more than widths of the second and third magnets. An upper surface of the first magnet is located on a mirror unit side with respect to upper surfaces of the second and third magnets in the second direction, or is located at the same position as one of the upper surfaces of the second and third magnets and on the mirror unit side with respect to the other of the upper surfaces of the second and third magnets in the second direction. The mirror unit is fixed to at least the upper surface of the first magnet.

Abstract: In a mirror unit, a first wall portion is higher than a second wall portion. A window member is disposed on a top surface of the first wall portion and a top surface of the second wall portion and is inclined with respect to a mirror surface. When any one of first to fourth wall portions is set as a first reference wall portion, in a cross-section perpendicular to the first reference wall portion, a first line passing through a first end at a side of the first reference wall portion in the mirror surface and a first corner portion formed at the side of the first reference wall portion by an outer surface and a first side surface in the window member intersects the first wall portion. A wiring portion includes a portion extending inside a base and leads outside a frame member.