Abstract: Provided is a phenolic hydroxy group-containing resin having sufficient solubility in organic solvents, having excellent infiltratability into microscopic spaces because of having low viscosity and low polarity, and being capable of being used for ultrafine wiring pattern formation. Specifically, provided is a phenolic hydroxy group-containing resin containing one or more phenolic hydroxy group-containing compounds (1) selected from the group consisting of a compound (1) represented by Structural Formula (1) below and a compound (1?) represented by Structural Formula (1?) below.

Abstract: Techniques for searching for phenol compounds are to be improved. A method for searching for a novolac phenol resin that is performed by an information processing device includes the steps of: generating a plurality of prediction models corresponding to a plurality of objective variables, using actual data pertaining to a novolac phenol resin; and searching for a novolac phenol resin having a desired physical property balance by inverse analysis using the prediction models. The actual data includes a polymer composition, a structural formula, a reaction solvent, and a reaction parameter pertaining to the novolac phenol resin. The objective variables include developability, heat resistance, and molecular weight.

Abstract: Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Abstract: To provide a resist material that can form a film with high smoothness and uniformity and has high patterning performance, such as resolution, a resist material is provided that contains a calixarene compound (A) with a molecular structure represented by the following structural formula (1) and a resin component (B); wherein R1 denotes a perfluoroalkyl group or a structural moiety with a perfluoroalkyl group; R2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group; R3 denotes a hydrogen atom, an aliphatic hydrocarbon group that optionally has a substituent, or an aryl group that optionally has a substituent; n denotes an integer in the range of 2 to 10; and * denotes a bonding point with an aromatic ring.

Abstract: A calixarene compound represented by formula (1) below is provided. The calixarene compound contains, per molecule, at least one —CH2OH group or phenolic hydroxy group and at least one carbon-carbon unsaturated bond. R1's are a structural moiety (A), which has a —CH2OH group; a structural moiety (B), which has a carbon-carbon unsaturated bond; a structural moiety (C), which has a —CH2OH group and a carbon-carbon unsaturated bond; a monovalent organic group (D), which is different from (A), (B), and (C); or a hydrogen atom (E). R2's are (A), (B), (C), (D), or (E) provided that not all R2's are (E). R3's are one of a hydrogen atom, an aliphatic hydrocarbon group, and an aryl group, n is 2 to 10. * is a point of attachment to an aromatic ring. A curable composition including the calixarene compound is provided.

Abstract: Provided is a calixarene compound represented by structural formula (1). In structural formula (1), R1 and R2 each independently represent a structural moiety (A) having a functional group (I), a structural moiety (B) having a functional group (II) having a carbon-carbon unsaturated bond (excluding maleate groups), a structural moiety (C) having both the functional group (I) and the functional group (II), a monovalent organic group (D) that has 1 to 20 carbon atoms and is other than the structural moieties (A), (B) and (C), or a hydrogen atom (E). At least one of a plurality of R2s is the structural moiety (A), the structural moiety (B), the structural moiety (C), or the organic group (D).

Abstract: The invention provides a novolak resin having excellent properties such as heat resistance, alkali developability, photosensitivity and resolution, a photosensitive composition including the novolak resin, a curable composition including the novolak resin, a cured product thereof, and a resist material which uses the photosensitive composition or the curable composition. The novolak resin is one obtained from a compound (A) having a tris(hydroxyaryl)methine group and an aldehyde compound (B) as essential reaction ingredients. The photosensitive composition includes the novolak resin. The curable composition includes the novolak resin, and the cured product is one obtained from such a composition. The resist material uses the photosensitive composition or the curable composition.

Abstract: A compound useful as a release agent, and a release agent, a curable composition, and a nanoimprint lithography resin material each containing the compound are provided. More specifically, a calixarene compound with a molecular structure represented by the following structural formula (1) and a composition containing the calixarene compound are provided. wherein R1 denotes a structural moiety with a perfluoroalkyl group, R2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group, R3 denotes a hydrogen atom, an aliphatic hydrocarbon group that may have a substituent, or an aryl group that may have a substituent, n denotes an integer in the range of 2 to 10, and * denotes a bonding point with an aromatic ring.

Abstract: A calixarene compound represented by formula (1) below is provided. The calixarene compound contains, per molecule, at least one —CH2OH group or phenolic hydroxy group and at least one carbon-carbon unsaturated bond. R1's are a structural moiety (A), which has a —CH2OH group; a structural moiety (B), which has a carbon-carbon unsaturated bond; a structural moiety (C), which has a —CH2OH group and a carbon-carbon unsaturated bond; a monovalent organic group (D), which is different from (A), (B), and (C); or a hydrogen atom (E). R2's are (A), (B), (C), (D), or (E) provided that not all R2's are (E). R3's are one of a hydrogen atom, an aliphatic hydrocarbon group, and an aryl group. n is 2 to 10. * is a point of attachment to an aromatic ring. A curable composition including the calixarene compound is provided. A cured product of the curable composition is provided.

Abstract: To provide a resist material that can form a film with high smoothness and uniformity and has high patterning performance, such as resolution, a resist material is provided that contains a calixarene compound (A) with a molecular structure represented by the following structural formula (1) and a resin component (B); wherein R1 denotes a perfluoroalkyl group or a structural moiety with a perfluoroalkyl group; R2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group; R3 denotes a hydrogen atom, an aliphatic hydrocarbon group that optionally has a substituent, or an aryl group that optionally has a substituent; n denotes an integer in the range of 2 to 10; and * denotes a bonding point with an aromatic ring.

Abstract: There are provided a phenolic-hydroxyl-group-containing novolac resin and resist film that are excellent in developability, heat resistance, and conformability to substrates. The phenolic-hydroxyl-group-containing novolac resin is a polycondensate of which the essential reactive components are a phenolic-hydroxyl-group-containing compound (A) represented by Structural Formula (1) [where Ar is a structural part represented by Structural Formula (Ar-1) or (Ar-2), a phenolic-hydroxyl-group-containing compound (B) represented by Structural Formula (2) [where R3 is an aliphatic hydrocarbon group having 4 to 20 carbon atoms, and j is an integer from 1 to 3], and an aldehyde compound (C).

Abstract: Provided are a naphtol-type calixarene compound having high solvent solubility, a method for producing the naphthol-type calixarene compound, a photosensitive composition that contains the naphthol-type calixarene compound and provides a coating having high thermal decomposition resistance, alkali developability, photosensitivity, and resolution, and a resist material and a coating each being made of the photosensitive composition. Specifically, provided is a naphthol-type calixarene compound including a molecular structure represented by general formula (1). [In the formula (1), R1 represents a hydrogen atom, an alkyl group, an alkoxy group, an optionally substituted aryl group, an optionally substituted aralkyl group, or a halogen atom, and a plurality of R1 may be the same or different from each other; R2 represents an optionally substituted alkyl group or an optionally substituted aryl group; and n represents an integer of 2 to 10].

Abstract: Provided are a resin containing phenolic hydroxyl groups having excellent developability, heat resistance, and substrate followability, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl group. The resin containing phenolic hydroxyl groups obtained by reacting a novolac resin intermediate obtained by reacting a triarylmethane compound (A) with an aldehyde compound (B) as essential components, with an alkene compound (C) having 9 to 24 carbon atoms, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl groups.

Abstract: A compound useful as a release agent, and a release agent, a curable composition, and a nanoimprint lithography resin material each containing the compound are provided. More specifically, a calixarene compound with a molecular structure represented by the following structural formula (1) and a composition containing the calixarene compound are provided. wherein R1 denotes a structural moiety with a perfluoroalkyl group, R2 denotes a hydrogen atom, a polar group, a polymerizable group, or a structural moiety with a polar group or a polymerizable group, R3 denotes a hydrogen atom, an aliphatic hydrocarbon group that may have a substituent, or an aryl group that may have a substituent, n denotes an integer in the range of 2 to 10, and * denotes a bonding point with an aromatic ring.

Abstract: The invention provides a novolak resin having excellent properties such as heat resistance, alkali developability, photosensitivity and resolution, a photosensitive composition including the novolak resin, a curable composition including the novolak resin, a cured product thereof, and a resist material which uses the photosensitive composition or the curable composition. The novolak resin is one obtained from a compound (A) having a tris(hydroxyaryl)methine group and an aldehyde compound (B) as essential reaction ingredients. The photosensitive composition includes the novolak resin. The curable composition includes the novolak resin, and the cured product is one obtained from such a composition. The resist material uses the photosensitive composition or the curable composition.

Abstract: A phenolic hydroxyl-containing compound is provided. The compound dissolves well in solvents and can be formulated into compositions that give coatings superior in thermal decomposition resistance, alkali developability, resolution, and dry-etch resistance. Specifically, the compound is a phenolic hydroxyl-containing calixarene represented by structural formula (1): (where A is a structural unit including a dihydroxynaphthalene- or naphthol-derived structure optionally with a substituent alkyl, alkoxy, aryl, or aralkyl group or halogen atom on the aromatic rings and a methylene group optionally having an alkyl or aryl group in place of one of the hydrogen atoms) and obtained using a dihydroxynaphthalene in combination with a naphthol, with the total repeat number p being an integer of 2 to 10.

Abstract: Provided are a novolac-type phenolic hydroxy group-containing resin having excellent developability, heat resistance, and dry etching resistance and a resist film. The novolac-type phenolic hydroxy group-containing resin includes, as a repeating unit, a structural moiety (I) represented by Structural Formula (1): wherein Ar represents an arylene group; R1's each independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and m's each independently represent an integer of 1 to 3, or a structural moiety (II) represented by Structural Formula (2): wherein Ar represents an arylene group; R1's each independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom; and m's each independently represent an integer of 1 to 3.

Abstract: A curable composition and a permanent resist film made using this curable composition are provided. The composition dissolves well in solvents, gives coatings superior in alkali developability, thermal decomposition resistance, light sensitivity, and resolution, and is particularly suitable for the formation of permanent resist films. Specifically, the composition is a curable composition for permanent resist films and contains a phenolic hydroxyl-containing compound (A) that has a molecular structure represented by structural formula (1): (where R1 is hydrogen, alkyl, or aryl, and n is an integer of 2 to 10; R2 is alkyl, alkoxy, aryl, aralkyl, or halogen, and m is an integer of 0 to 4; if m is 2 or more, the plurality of R2s may be the same or different from one another, and may be bonded to either of the two aromatic rings in the naphthylene structure) and a photosensitizer (B1) or curing agent (B2).

Abstract: Provided is a novolac resin having excellent developability, heat resistance, and dry etching resistance, and a resist film. A novolac resin includes a cyclic novolac resin (A) having a molecular structure represented by Structural Formula (1): (in the formula, ? is a structural moiety (?) represented by Structural Formula (2): n is an integer of 2 to 10), in which at least one of X's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group, at least one of the structural moieties (?) present in the resin is a structural moiety (?1) in which l is 1, and at least one thereof is a structural moiety (?2) in which l is 2.

Abstract: Provided are a novolac resin having developability, heat resistance, and dry etching resistance, and a photosensitive composition, a curable composition, and a resist film. A novolac resin including, as a repeating unit, a structural moiety represented by Structural Formula (1) or (2): (in the formula, Ar represents an arylene group, R1's each independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, and a halogen atom, m's each independently represent an integer of 1 to 3, and X is any one of a hydrogen atom, a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group) in which at least one of X's present in the resin is any one of a tertiary alkyl group, an alkoxyalkyl group, an acyl group, an alkoxycarbonyl group, a hetero atom-containing cyclic hydrocarbon group, and a trialkylsilyl group.