Abstract: An object of the present invention is to provide a 2,6-dioxo-3,6-dihydropyrimidine compound that has excellent bactericidal and antimicrobial activity, has excellent safety, and can be industrially favorably synthesized, and an agricultural and horticultural fungicide, a nematicide, and an antifungal agent for use in medicine/animals that contain the compound as an active ingredient.

Abstract: A package for housing an electronic component includes: a base portion including a first surface including a recessed portion in which an electronic component is mounted and also including a second surface located on an opposite side to the first surface; an external connection conductor located on the second surface; internal wiring located inside the base portion; first wiring located on the second surface and connected to the internal wiring; and second wiring located between the first wiring and the external connection conductor and connected to the external connection conductor, in which the first wiring and the second wiring are covered with an insulating layer.

Abstract: A heat exchange flow path portion is formed by alternately winding two spirally-shaped first and second heat transfer walls, with a predetermined gap interposed therebetween in the radial direction of the flow path pipe, around the outer periphery of a cylindrical flow path pipe, in which a cooling heat source is disposed in a main heat transfer flow path inside thereof. An inlet flow path and an outlet flow path for introducing compressed air into the flow path pipe and discharging compressed air from the flow path pipe are alternately formed, in the radial direction, from the gap between the heat transfer walls. Heat exchange is performed between compressed air that flows in the flow path and compressed air that flows in the flow path.

Abstract: Provided is a scattering measurement analysis method including obtaining a theoretical scattering intensity from a structural model that contains a lot of scatterers, wherein the obtaining of a theoretical scattering intensity includes obtaining a contribution to the theoretical scattering intensity of a pair of a scatterer “m” and a scatterer “n” existing at a distance “r” from the scatterer “m” among a plurality of scatterers by at least one of calculations in accordance with the distance “r”, the calculations including a first calculation of calculating contributions of the scatterer “m” and the scatterer “n” from respective scattering factors fm(q) and fn*(q) and a center-to-center distance rmn between the scatterer “m” and the scatterer “n”, and a second calculation of substituting the scattering factor fn*(q) of the scatterer “n” by a first representative value and substituting a probability density function of the number of scatterers existing at the distance “r” by a constant value.

Abstract: A heat exchange flow path portion is formed by alternately winding two spirally-shaped first and second heat transfer walls, with a predetermined gap interposed therebetween in the radial direction of the flow path pipe, around the outer periphery of a cylindrical flow path pipe, in which a cooling heat source is disposed in a main heat transfer flow path inside thereof ?n inlet flow path and an outlet flow path for introducing compressed air into the flow path pipe and discharging compressed air from the flow path pipe are alternately formed, in the radial direction, from the gap between the heat transfer walls. Heat exchange is performed between compressed air that flows in the flow path and compressed air that flows in the flow path.

Abstract: An X-ray stress measurement apparatus having: a camera for producing an optical image of a sample; a display for displaying the optical image; an input device capable of inputting positions on a display screen; an X-ray source for generating an X-ray; a table for moving the sample; an X-ray detector for detecting an X-ray exiting the sample; a measurement program for determining the measurement positions of the sample on the basis of the positions indicated by the input device, and measuring the determined measurement positions of the sample; a stress computation program for computing the stress at the measurement positions of the sample on the basis of an output signal from the X-ray detector; and an image formation program for causing the optical image, the measurement positions of the sample, the absolute value of the stress, and the direction of the stress to be displayed on the same display screen.

Abstract: An X-ray stress measurement apparatus having: a camera for producing an optical image of a sample; a display for displaying the optical image; an input device capable of inputting positions on a display screen; an X-ray source for generating an X-ray; a table for moving the sample; an X-ray detector for detecting an X-ray exiting the sample; a measurement program for determining the measurement positions of the sample on the basis of the positions indicated by the input device, and measuring the determined measurement positions of the sample; a stress computation program for computing the stress at the measurement positions of the sample on the basis of an output signal from the X-ray detector; and an image formation program for causing the optical image, the measurement positions of the sample, the absolute value of the stress, and the direction of the stress to be displayed on the same display screen.

Abstract: An electronic component mount structure includes a printed circuit board, a wiring portion, a through-holed portion, a heat conducting apertured portion and an electronic component. The printed circuit board has a component mount surface and a solder-dip surface. The wiring portion is formed on at least one of the component mount surface and the solder-dip surface. The through-holed portion extends through the circuit board and is connected to be electrically conductive with the wiring portion. The heat conducting apertured portion extends through the circuit board and is connected to be electrically conductive with the wiring portion. Here, the heat conducting apertured portion is formed in the vicinity of the through-holed portion. A lead portion of the electronic component is inserted to the through-holed portion of the printed circuit board from the component mount surface and soldered to the printed circuit board.

Abstract: A gear finishing apparatus having a construction in which a support gear supported by a finishing wheel holding section can support and fix a plurality of finishing wheels in parallel, wherein a finishing wheel holding section makes it possible to move an operating portion for holding and rotating the finishing wheel in a direction parallel to the axis of the finishing wheel and to fix it at predetermined positions within the extent of the movement. If the plurality of finishing wheels are attached to the support gear and the positions thereof are adjusted in advance, a new finishing wheel in an adjusted position can be brought into a processing position by moving and fixing the operating portion of the finishing wheel holding section when one of the attached finishing wheels is worn out, thereby obtaining a rapid and continuous finish processing. Further, if different kinds of finishing wheels are attached in advance, the time required for finishing different kinds of gears to be processed can be reduced.