Abstract: A method includes providing a first laminate and a second laminate. The first laminate includes a first conductor layer, a first insulating layer containing polyimide, and a second conductor layer. The second laminate includes a second insulating layer containing polyimide and a third conductor layer. The method further includes: heating each of the first laminate and the second laminate under a condition including a heating temperature equal to or higher than 100° C. and a heating duration equal to or longer than half an hour; and stacking, after heating, the first laminate and the second laminate one on top of the other with a third insulating layer interposed between the second conductor layer and the second insulating layer.

Abstract: A digital miter saw for cutting a workpiece includes a base, a member supported on the base and moveable relative to the base, and a cutting member moveable with the member. A detector is provided for detecting at least one of a miter angle and a bevel angle between the cutting member and the workpiece, and for outputting a signal indicative of the at least one detected angle, and a digital controller is provided which has an interface operable to receive the signal.

Abstract: A digital miter saw for cutting a workpiece includes a base, a member supported on the base and moveable relative to the base, and a cutting member moveable with the member. A detector is provided for detecting at least one of a miter angle and a bevel angle between the cutting member and the workpiece, and for outputting a signal indicative of the at least one detected angle, and a digital controller is provided which has an interface operable to receive the signal.

Abstract: A miter saw for displaying angle of a cutter blade cutting the workpiece. The miter saw has a base mounting a workpiece thereon, a movable member movably supported to the base, and a cutting unit connected to the movable member for supporting the cutter blade. A positioning portion is associated with the movable member and provides a predetermined nominal position of the movable member with respect to the base. The predetermined nominal position includes a reference position and other positions labeled angle. A detector detects the position of the movable member with respect to the base. A processor sets an angle between the reference position and the predetermined nominal position as a displayed moving amount when the movable member is positioned at the predetermined nominal position. Otherwise, the processor computes the moving amount based on the output signal from the detector.

Abstract: A miter saw for displaying angle of a cutter blade cutting the workpiece. The miter saw has a base mounting a workpiece thereon, a movable member movably supported to the base, and a cutting unit connected to the movable member for supporting the cutter blade. A positioning portion is associated with the movable member and provides a predetermined nominal position of the movable member with respect to the base. The predetermined nominal position includes a reference position and other positions labeled angle. A detector detects the position of the movable member with respect to the base. A processor sets an angle between the reference position and the predetermined nominal position as a displayed moving amount when the movable member is positioned at the predetermined nominal position. Otherwise, the processor computes the moving amount based on the output signal from the detector.

Abstract: In wiring circuit board having fine and isolated conductor circuit pattern, a metal deposit coat is formed at desired position on the isolated conductor circuit pattern without damaging conductor circuit of the pattern, as an object of the invention. An electrically conducting layer consisting of a material electrically conducting and peelable with one of heat, solvent and alkali is formed on the wiring circuit board so as to be at least in contact with the isolated conductor circuit pattern on which the deposit coat is to be formed, a peelable protect layer is formed to be superposed on the electrically conducting layer at least at other portions than the portion where the deposit coat is to be formed, a metal deposition is performed on the portion not coated with the protect layer by means of an electroplating with the electrically conducting layer used as a power supply layer, and the electrically conducting and protect layers left on the wiring circuit board are peeled off.