Abstract: A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depresses the workpiece (W) held by the holding mechanism (13) toward the wire (12).

Abstract: Provided is a wire saw where a wire (47) extends and is wound around a plurality of machining rollers (45), the wire (47) is moved in a circulating manner around the machining rollers (45) due to rotation of the machining rollers (45), and a workpiece (49) is cut by the wire (47) at a workpiece cutting position. The wire saw includes a supply pallet (67) which guides the workpiece (49) to move toward the wire (47) at the workpiece cutting position in an upright state. The wire saw also includes a receiving pallet (100) which is arranged at a workpiece receiving position located downstream of the workpiece cutting position in the workpiece conveying direction, and receives the cut workpiece (49) with the workpiece (49) being kept in an upright state.

Abstract: A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depresses the workpiece (W) held by the holding mechanism (13) toward the wire (12).

Abstract: Provided is a wire saw where a wire (47) extends and is wound around a plurality of machining rollers (45), the wire (47) is moved in a circulating manner around the machining rollers (45) due to rotation of the machining rollers (45), and a workpiece (49) is cut by the wire (47) at a workpiece cutting position. The wire saw includes a supply pallet (67) which guides the workpiece (49) to move toward the wire (47) at the workpiece cutting position in an upright state. The wire saw also includes a receiving pallet (100) which is arranged at a workpiece receiving position located downstream of the workpiece cutting position in the workpiece conveying direction, and receives the cut workpiece (49) with the workpiece (49) being kept in an upright state.

Abstract: A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.

Abstract: A finishing grindstone member 20 is fixed to a spindle 10 by a bolt. In the spindle 10, there is formed a tool mounting portion 25 into which a rough grindstone member can be mounted. Into the tool mounting portion 25, there can be mounted not only the rough grindstone member but also a cover member 36. After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member 20, the cover member 36 is mounted onto the tool mounting portion 25 to thereby prevent the tool mounting portion 25 from being soiled.