Patents by Inventor Tomoyuki Konuma

Tomoyuki Konuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7396448
    Abstract: There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and a mirror surface finish grinding not depending on a grinding stone grinding can be carried out in a short period of time and a high quality roll can be provided. The grinding is carried out after applying the copper sulfate plating to the roll to attain a mirror surface finish state. The copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to the rotating process roll and approached to the lower surface of the roll, plating liquid having some avoidable impurities becoming a cause of particles or pits removed through a filter so as to perform a plating having no thickened portions at both ends of the roll.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: July 8, 2008
    Assignee: Think Laboratory Co., Ltd.
    Inventors: Manabu Inoue, Kazuhiro Sukenari, Noriko Matsumoto, Tomoyuki Konuma, Tatsuo Shigeta
  • Publication number: 20060065533
    Abstract: There are provided a plating method for a roll and a grinding method before a cell is formed in which copper sulfate plating having a uniform thickness without any particles or pits can be applied to the roll for a gravure printing, both a middle finish grinding and a mirror surface finish grinding not depending on a grinding stone grinding can be carried out in a short period of time and a high quality roll can be provided. The grinding is carried out after applying the copper sulfate plating to the roll to attain a mirror surface finish state. The copper sulfate plating is carried out in such a way that non-soluble anode having a length more than the maximum roll length is ascended to the rotating process roll and approached to the lower surface of the roll, plating liquid having some avoidable impurities becoming a cause of particles or pits removed through a filter so as to perform a plating having no thickened portions at both ends of the roll.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 30, 2006
    Inventors: Manabu Inoue, Kazuhiro Sukenari, Noriko Matsumoto, Tomoyuki Konuma, Tatsuo Shigeta