Patents by Inventor TOMOYUKI SEKIYA

TOMOYUKI SEKIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT INSULATION STRUCTURE AND ELECTRONIC APPARATUS
    Publication number: 20220235928
    Abstract: A heat insulation structure of one embodiment of the present disclosure includes: a heat source; a heat insulating member surrounding the heat source and having an opening; and a shape retaining member retaining a shape of the heat insulating member.
    Type: Application
    Filed: June 10, 2020
    Publication date: July 28, 2022
    Inventors: TOMOYUKI SEKIYA, SHIRO ASASHIMA, TAKEO MITSUI