Abstract: A lamination method includes: a bonding step of bonding a support to a main surface of a substrate while transporting the substrate and the support along predetermined transport paths; and a curing step of curing an adhesive after the bonding step, and the bonding step is performed to bond the substrate and the support together while sequentially passing the substrate and the support through two or more nip roller pairs and, of the two or more nip roller pairs, a nip roller pair provided downstream has a nip distance set to be equal to or smaller than a nip distance of a nip roller pair provided upstream. The lamination method and a laminate obtained thereby can reduce film thickness variations in a substrate to achieve a high film thickness accuracy, ensures high versatility, and can suppress cost increases.

Abstract: A damping apparatus has a first damper mechanism positioned at a leading end of a sheet which is introduced into a sheet stacking region, for movement in the direction A away from the sheet stacking region to absorb shocks produced by the sheet when the sheet hits the first damper mechanism, and a second damper mechanism combined with the first damper mechanism, for movement in the direction A away from the sheet stacking region to absorb the shocks produced by the sheet S while the shocks produced by the sheet are being absorbed by the first damper mechanism and then after the first damper mechanism starts moving back in the direction B toward the sheet stacking region. Sheets can successively be introduced at a high speed into the sheet stacking region, and are effectively prevented from being folded or improperly positioned in the sheet stacking region.