Abstract: A burn-in board capable of realizing a uniform temperature distribution inside a burn-in board is provided. A burn-in board includes: a plurality of sockets; a burn-in board body including an upper surface for mounting the sockets thereon and a lower surface on the side opposite to the upper surface; a reinforcement frame contacting the lower surface; a bottom cover contacting the reinforcement frame; a heat conduction plate interposed between the burn-in board body and the bottom cover; and a heat conduction sheet thermally connecting the burn-in board body to the heat conduction plate, in which the reinforcement frame presses the heat conduction plate toward the heat conduction sheet.

Abstract: A burn-in board capable of realizing a uniform temperature distribution inside a burn-in board is provided. A burn-in board includes: a plurality of sockets; a burn-in board body including an upper surface for mounting the sockets thereon and a lower surface on the side opposite to the upper surface; a reinforcement frame contacting the lower surface; a bottom cover contacting the reinforcement frame; a heat conduction plate interposed between the burn-in board body and the bottom cover; and a heat conduction sheet thermally connecting the burn-in board body to the heat conduction plate, in which the reinforcement frame presses the heat conduction plate toward the heat conduction sheet.

Abstract: It is an object to use an additional circuit to increase speed and functioning of an existing test apparatus at a low cost. Provided is a test apparatus that is connected to a socket board corresponding to a type of device under test and tests the device under test. The test apparatus comprises a test head including therein a test module that tests the device under test; a function board that is connected to the test module in the test head via a cable and also connected to the socket board; and an additional circuit that is loaded on the function board and connected to the test module and the device under test.

Abstract: A board mount-type connector having an insulative housing with a base and a row of contacts carried by the housing is disclosed. Each contact has a centerpiece secured to the housing along a substantially vertically upright inner wall of the base, a mating interface connected to one end of the centerpiece so that the mating interface contacts a mating contact, and a board interface connected to the remaining end of the centerpiece so that the board interface connects to a circuit board. Each board interface has a bend that initially extends away from an extension line associated with a generally vertically upright portion of the respective centerpiece and that is bent back toward the extension line. A pad interface extends from the free end of the board interface toward the extension line and the contacts of the row are staggered along a length of the row.