Abstract: A gas circuit breaker includes a first arc contactor electrically connected to a first lead-out conductor, a cylindrical guide portion provided on a second lead-out conductor side, a trigger electrode arranged to be movable between the first arc contactor and the guide portion, and igniting an arc along with a movement in a first half of a current breaking action, a compression chamber being formed by a cylinder having an outer wall and an inner wall both formed in a cylindrical shape, and a piston sliding between the outer wall and the inner wall, and an insulation nozzle guiding the arc-extinguishing gas to an arc ignited at the first arc contactor. The insulation nozzle is formed integrally with the inner wall of the cylinder.

Abstract: A gas circuit breaker includes a trigger electrode which is arranged to be movable between a first arc contactor and a second arc contactor, a compression chamber for pressurizing arc-extinguishing gas, the compression chamber being formed by a cylinder which has an outer wall and an inner wall, each being formed in a cylindrical shape, and which is provided to the second arc contactor, and a piston that slides between the outer wall and the inner wall in conjunction with the trigger electrode, and an insulation nozzle that guides the arc-extinguishing gas pressurized in the compression chamber to an arc ignited between the first arc contactor and the second arc contactor. The insulation nozzle is supported by the inner wall of the cylinder.

Abstract: There is provided a gas circuit breaker that can appropriately ensure a pressure and a density of arc-extinguishing gas to be sprayed to an arc, and can more surely maintain electric insulation performance.

Abstract: A gas circuit breaker comprises: a first arc contactor 21; a cylindrical second arc contactor 41; a rod-shaped trigger electrode 31 that is disposed to be movable between the first arc contactor 21 and the second arc contactor 41, and moves inside the cylindrical second arc contactor 41 to ignite an arc at the second arc contactor 41 in the latter half of the current break interval; and a guide portion 41b that has an inner diameter larger than the outer diameter of the trigger electrode 31, has an inner diameter smaller than the inner diameter of a portion of the second arc contactor 41 which is close to the trigger electrode 31, and is disposed in the cylinder of the second arc contactor 41 so as to go around the trigger electrode 31 when the trigger electrode 31 is in a closed state with the first arc contactor 21.

Abstract: A gas circuit breaker 1 includes an insulation nozzle 23 that guides arc-extinguishing gas to an arc between a first arc contactor 21 and a second arc contactor 41 when a trigger electrode 31 becomes an opened state relative to the first arc contactor 21. The second arc contactor 41 has an opening 41a for spraying the arc-extinguishing gas, and the opening 41a is closed by the trigger electrode 31 in the first half of a current breaking action, and is opened by separation of the trigger electrode in the latter half of the current breaking action. An opening area of a first exhaust port 41b formed between the second arc contactor 41 and the insulation nozzle 23 for exhausting the arc-extinguishing gas is 0.2 times or more and two times or less of an opening area of the opening 41a of the second arc contactor 41.

Abstract: There is provided a gas circuit breaker that can reduce deformation of an insulation nozzle and leakage of arc-extinguishing gas compressed to be sprayed to an arc, and can more surely maintain electric insulation performance.

Abstract: There is provided a gas circuit breaker that can suppress the mechanical vibration during movement of the moving electrode, reduce the generation of a triple junction during operation of the gas circuit breaker and the generation of the metal foreign materials, and maintain the electrical insulation performance more reliably.

Abstract: There is provided a gas circuit breaker that can spray arc-extinguishing gas to arcs while preventing a spraying velocity from being reduced and can efficiently and more surely extinguish the arcs that have been generated in a scatteredly around electrodes. A gas circuit breaker 1 includes an insulation nozzle 23 that guides arc-extinguishing gas to an arc between the first arc contactor 21 and a second arc contactor 41 when a trigger electrode 31 becomes an opened state relative to a first arc contactor 21. A second arc contactor 41 has an opening 41a for spraying the arc-extinguishing gas, and the opening 41a is closed by the trigger electrode 31 in the first half of a current breaking action, and is opened by separation of the trigger electrode in the latter half of the current breaking action. An opening area of a first exhaust port 41b formed between the second arc contactor 41 and the insulation nozzle 23 for exhausting the arc-extinguishing gas is 0.

Abstract: According to an embodiment, a gas-blast circuit breaker comprises a heat removal unit in a flow path of arc extinguishing gas. The heat removal unit each includes: plate-shaped heat removal members contacting the arc extinguishing gas flowing in the flow path; and a holding portion holding the plate-shaped heat removal members to stack the heat removal members at intervals in a thickness direction. Each of the heat removal members includes: an upstream side end portion; a downstream side end portion; and a thickest portion with a largest thickness which is provided between the upstream side end portion and the downstream side end portion. Thickness of the heat removal member continuously changes between the upstream side end portion and the downstream side end portion via the thickest portion.

Abstract: According to an embodiment, a gas-blast circuit breaker comprises a heat removal unit in a flow path of arc extinguishing gas. The heat removal unit each includes: plate-shaped heat removal members contacting the arc extinguishing gas flowing in the flow path; and a holding portion holding the plate-shaped heat removal members to stack the heat removal members at intervals in a thickness direction. Each of the heat removal members includes: an upstream side end portion; a downstream side end portion; and a thickest portion with a largest thickness which is provided between the upstream side end portion and the downstream side end portion. Thickness of the heat removal member continuously changes between the upstream side end portion and the downstream side end portion via the thickest portion.

Abstract: A semiconductor device comprises a semiconductor chip mounted on an island, and a plurality of leads spaced form the island and connected by wires to the semiconductor chip. An insulating film encapsulates the island, the semiconductor chip, the wires and the leads, and the insulating resin has a concave portion that is in contact with the leads. Each lead has a bottom surface exposed from the insulating resin, and the concave portion of the insulating resin exposes side surfaces which surround the bottom surface of each of the leads located under a bottom surface of the insulating resin. When the semiconductor device is soldered to a circuit board, the concave portion prevents contact between the solder and the insulating resin and improves self-alignment of the semiconductor device on the circuit board.

Abstract: A semiconductor flat package has a semiconductor chip, leads connected to the semiconductor chip, and an encapsulation resin covering the semiconductor chip and partially covering the leads. Outer end surfaces of the leads are exposed from the encapsulation resin and covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flush with each other. A material with good solder wettability is formed at a lead cut portion of the semiconductor flat package, to thereby improve solder connection strength with a circuit board. A solder fillet is formed from the lead cut portion of the semiconductor package, to thereby enable adaptation of solder automatic visual inspection after mounting.

Abstract: Provided is a semiconductor flat package with improved mountability. In a semiconductor device, an end surface of a lead, which is exposed from an encapsulation resin, is covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flush with each other. A material with good solder wettability is formed at a lead cut portion of the semiconductor flat package, to thereby improve solder connection strength with a circuit board. A solder fillet is formed from the lead cut portion of the semiconductor package, to thereby enable adaptation of solder automatic visual inspection after mounting.

Abstract: Provided is a semiconductor package with improved mounting property. A concave portion is provided in an insulating resin between an island for mounting a semiconductor chip thereon and an opposing lead, to thereby prevent contact between solder printed on a circuit board and the insulating resin. Self-alignment property in melting solder is improved to increase an effective bonding area.

Abstract: A semiconductor device has an element encapsulated in a resin mold. Metal leads protruding from the resin mold are solder plated except at the lead-tip end surfaces, and the exposed lead-tip end surfaces have an area less than half the cross-sectional area of the protruding metal leads. The semiconductor device is manufactured using a lead frame in which the metal leads are connected to a frame by plating bars having a thickness smaller than half the thickness of the metal leads. In another embodiment, the metal leads are connected to the frame by plating bars that extend sideways from the metal leads, and the end tips of the metal leads are entirely covered with plating to improve soldering wettability.

Abstract: Provided is a semiconductor device having an element covered with a resin mold and a metal lead protruding from the resin mold in which a lead-tip portion thereof is entirely covered by solder plating and in which a lead-tip end surface, which is not covered by solder plating, has an area less than half of a cross-sectional area of the metal lead, whereby solder wettability of the metal lead is improved and a bonding strength to a circuit board is also improved.

Abstract: A piezoelectric actuator is formed in a manner which enhances the identifying function of markings provided thereon, and minimizes the influence on the markings when an electrode pattern on the piezoelectric actuator is shifted. The piezoelectric actuator has a piezoelectric element, an electrode pattern formed thereon, and at least one identifying marking formed on the electrode pattern, each identifying marking having a shape comprising multiple sides and being formed at a specific location of the electrode pattern for use in identifying a characteristic of the electrode pattern.

Abstract: The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.

Abstract: An ultrasonic motor in which a voltage is applied to a piezoelectric element by using a lead board. To fabricate the motor in a simplified manner, it is so constructed that a plurality of conductive patterns on the lead board are joined to a plurality of electrodes formed on the piezoelectric element by solder or the like, the piezoelectric element and the lead board are prevented from contacting each other by bending the conductive patterns to form a gap, then a voltage is applied to the lead board, thereby realizing the drive.

Abstract: A semiconductor device comprises at least two semiconductor elements connected together at a connecting region of the semiconductor elements. At least one joint chip is adhered to the connection region of the semiconductor elements for connecting the semiconductor elements together. The joint chip has a trapezoidal cross-section defining a first surface and a second surface wider than the first surface. The second surface of the joint chip is adhered to the connection region of the semiconductor elements.