Abstract: A problem to be solved by the present invention is to provide a resin composition suitable for spinning, particularly electrospinning, and in addition, to provide a heat-resistant non-woven fabric having excellent strength and a method of producing the same. A main object of the present invention is: to provide a resin composition including: (a) at least one heat-resistant resin or a precursor thereof, the heat-resistant resin being selected from the group consisting of a heat-resistant resin containing a nitrogen atom and a heat-resistant resin containing, in the main chain, a group selected from the group consisting of ether group, ketone group, sulfone group, and sulfide group; (b) a solvent; and (c) a surfactant having a fluoroalkyl group; and to form a non-woven fabric using the resin composition by an electrospinning method.

Abstract: A resin having a small linear thermal expansion coefficient and a low absorbance is provided.

Abstract: A resin composition contains: (a) a resin which constitutes a polymer having a structure represented by any one of the following general formulae (1) to (3) below and/or a copolymer having the structure; and (b) a basic compound, wherein R1 is a C4-C30 organic group, R2 is a divalent C4-C30 organic group, X is a sulfonic group, hydroxy group, or carboxy group, p is 1 to 4, and n is 2 to 100,000; wherein R3 is a C4-C30 organic group, R4 is a divalent C4-C30 organic group, Y is a sulfonic group, hydroxy group, or carboxy group, q is 1 to 4, and m is 2 to 100,000; wherein R5 represents a C4-C30 organic group, R6 is a divalent C4-C30 organic group, Z is a sulfonic group, hydroxy group, or carboxy group, r is 1 to 4, and l is 2 to 100,000.

Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

Abstract: An object of the present invention is to provide a resin composition containing: (a) a resin containing at least one of a polyimide, a polyamideimide, and a polybenzoxazole, having at least one acidic functional group among a phenolic hydroxyl group, a carboxyl group, and a sulfonic acid group in a side chain, and having an acidic functional group concentration of 3.4 mol/kg or more; and (b) a basic compound. The resin composition has high long-term stability in the form of an aqueous solution while having high strength and high modulus, has good dispersibility of a filler, and has a good binding property as a binder.

Abstract: A problem addressed by the present invention is to provide a resin out of which a heat-resistant non-woven fabric having a fine fiber diameter can be made by an electrospinning method.

Abstract: A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

Abstract: An object of the present invention is to provide a resin which can be used as an aqueous binder and has sufficient binding properties.

Abstract: A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

Abstract: The present invention provides a negative electrode material for a lithium ion secondary battery, a composite negative electrode material for a lithium ion secondary battery, a resin composition for a lithium ion secondary battery negative electrode, and a negative electrode for a lithium ion secondary electrode, which may provide high charge/discharge capacity, and excellent initial charge-discharge characteristics and capacity retention.

Abstract: A resin having a small linear thermal expansion coefficient and a low absorbance is provided.

Abstract: The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue.

Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance. A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

Abstract: Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.

Abstract: The present invention provides a negative electrode material for a lithium ion secondary battery, a composite negative electrode material for a lithium ion secondary battery, a resin composition for a lithium ion secondary battery negative electrode, and a negative electrode for a lithium ion secondary electrode, which may provide high charge/discharge capacity, and excellent initial charge-discharge characteristics and capacity retention.

Abstract: Disclosed is a resin composition for positive electrodes of lithium ion cells, which imparts strong adhesiveness and electrolyte injectability and shows good discharge and charge characteristics and input-output characteristics with smaller amount of a binder. The resin composition for positive electrodes of lithium ion cells is a resin composition for positive electrodes of lithium ion cells, which comprises a polyimide precursor whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. after being imidized is 3 to 50 ppm, and/or a polyimide whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. is 3 to 50 ppm, and a positive electrode active compound, wherein the positive electrode active compound is one obtained by coating the surface of a composite oxide containing lithium with a lithium ion conductive material.

Abstract: The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue.

Abstract: The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.

Abstract: Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.

Abstract: The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.