Abstract: A multiple semiconductor chip (multi-chip) module for use in power applications includes at least a power semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The power semiconductor chip may be a Silicon-On-Insulator (SOI) device and the control semiconductor chip may be a semiconductor device having a substrate connected to ground potential. The power semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics.

Abstract: A multiple semiconductor chip (multi-chip) module includes at least an output semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The output semiconductor chip may have a bulk substrate configuration and the control semiconductor chip may have a Silicon-On-Insulator (SOI) configuration. The output semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics such as enhanced heat sink efficiency and reduced EMI.

Abstract: A multiple semiconductor chip (multi-chip) module includes at least an output semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The output semiconductor chip may have a bulk substrate configuration and the control semiconductor chip may have a Silicon-On-Insulator (SOI) configuration. The output semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics such as enhanced heat sink efficiency and reduced EMI.

Abstract: A multiple semiconductor chip (multi-chip) module for use in high-power applications includes at least a power semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The power semiconductor chip may be a Silicon-On-Insulator (SOI) device and the control semiconductor chip may be a semiconductor device having a substrate connected to ground potential. The power semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics.

Abstract: In a switched-mode power supply, when the controller and the switching device are encapsulated together with a heat sink, in which the drain of the switching device is connected to the heat sink, the heat sink and the paths to the various pins of the controller forms various parasitic capacitances which, when the switching device switches injects inordinately large currents into the pins of the controller. In the case of the D.sub.MAG input, this may result in throwing the switched-mode power supply out of regulation. The sample-and-hold circuit connected to the D.sub.MAG input includes an additional comparator for comparing the current on the D.sub.MAG input to an extra large current. If the current on the D.sub.MAG input exceeds this extra large current, the sampling switch of the sample-and-hold circuit is held open while a clamp circuit is engaged on the D.sub.MAG input.

Abstract: In a switched-mode power supply, when the controller and the switching device are encapsulated together with a heat sink, in which the drain of the switching device is connected to the heat sink, the heat sink and the paths to the various pins of the controller forms various parasitic capacitances which, when the switching device switches, injects and withdraws inordinately large currents into and from the pins of the controller. In the case of the V.sub.CTRL pin to which is connected a discharge capacitor, the resulting under voltage across the capacitor may be used by circuitry connected to the V.sub.CTRL pin to control the switching of the switching device resulting in throwing the switched-mode power supply out of regulation. A track-and-hold circuit is now connected between the V.sub.CTRL pin and the circuitry to mirror the voltage across the discharge capacitor.

Abstract: A switched-mode power supply includes a transformer having a primary winding, a secondary winding and an auxiliary winding. A switching device is included in series with the primary winding for alternately interrupting the flow of current through the primary winding. The switched-mode power supply further includes a controller circuit connected to the auxiliary winding for receiving information related to an output voltage across the secondary winding and for controlling the switching of the switching device so as to maintain the information at a desired level. The controller circuit including a sample-and-hold circuit which is controlled to sample the information related to the output voltage only when there is current flowing in the secondary winding.

Abstract: A sample-and-hold circuit is provided for a switched-mode power supply of the type having a transformer with a primary winding, an auxiliary winding and a secondary winding, with a switching transistor coupled in series with the primary winding and a sample-and-hold capacitor for storing a voltage proportional to an output voltage of the auxiliary winding and coupled to a controlled terminal of the switching transistor in a feedback loop which normally operates in a closed-loop mode for switchably regulating the power supply. To prevent the feedback loop from being driven to an open-loop or "stuck" mode of operation, a discharge capacitor is provided which is switchably coupled in parallel with the sample-and-hold capacitor to discharge excess voltage from the sample-and-hold capacitor and thereby restore the feedback loop to its normal closed-loop operating mode.