Abstract: A light emitting device is disclosed herein. An embodiment of the light emitting device includes a cavity and at least one light emitter located within the cavity. A first transparent material fills at least a portion of the cavity and encapsulates the light emitter. A substantially rigid optical modifying element is located adjacent the first transparent material, the modifying element comprises particles that emit at least one first wavelength of light upon being illuminated by a second wavelength of light. The modifying element has a first side located adjacent the first transparent material and a second side located opposite the first side, wherein the first side is substantially flat. In addition, the modifying element is substantially uniform in thickness.

Abstract: The present invention is directed to a dimensionally-stable electronic device such as an LED on flexible printed-circuit-board. The device comprises an electrically-conductive flexible substrate and at least one stabilizing component for dimensionally stabilizing the substrate.

Abstract: An improved method for encapsulating LEDs in a polymer coat is described. A substrate houses an LED, and a polymer layer is brought into proximity with the substrate and LED. The polymer layer is melted over the substrate, encapsulating the LED onto the substrate.

Abstract: A light source that has improved light mixing. The light source uses a nanolens layer in conjunction with an LED light source to enhance the mixing of the colored light emitting from the LED light source.

Abstract: A thermally controllable substrate is disclosed. The substrate supports a heat generating source. One of more microchannels are embedded within the substrate and preferably circulate a cooling fluid to dissipate heat being generated by the source. The flow of the cooling fluid serves to remove heat entering the substrate proximate the source providing for the use of enhanced electrical devices which generate more heat in their normal operation.

Abstract: In one embodiment, a light-emitting apparatus includes a substrate having i) a plurality of overlapping panels that form acute angles with respect to an imaginary surface that bisects the overlapping panels, and ii) a plurality of recesses formed between overlapping portions of the overlapping panels. The recesses are open to the first side of the substrate, and the first side of the substrate has a reflective surface. A plurality of light sources is positioned to emanate light from the recesses.

Abstract: In one embodiment, a light-emitting apparatus includes a plurality of adjacent, overlapping light-guide plates formed of substantially transparent material, and a plurality of light sources. Each of the light-guide plates has i) first and second ends, ii) one or more substantially transparent surfaces through which light is emitted, and iii) one or more reflective surfaces to redirect light within the light-guide plate. Where first and second light-guide plates are adjacent, the first end of the first light-guide plate A) underhangs the second end of the second light-guide plate, and B) is positioned opposite a primary light-emitting side of the apparatus. The plurality of light sources are optically coupled to the first ends of the light-guide plates so as to illuminate the interiors of the light-guide plates.

Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

Abstract: In one embodiment, a light emitting diode (LED) device comprises an LED die for generating output light and an encapsulant sealing the LED die, the encapsulant comprising a conical structure extending away from the LED die and positioned above the LED die, wherein a profile of the conical structure causes a cone of light centered around an axis of symmetry of the LED die to experience total internal reflection.

Abstract: A substrate of a backlight is positioned behind a transmissive display. A plurality of low-power light emitting diodes (LEDs) are mounted on the substrate. The LEDs are positioned behind the display, and each LED is nominally operated at ?200 milliamps (and, more preferably, at ?100 milliamps).