Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least one CLD is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least one CLD is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least one CLD is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: An improved method for encapsulating LEDs in a polymer coat is described. A substrate houses an LED, and a polymer layer is brought into proximity with the substrate and LED. The polymer layer is melted over the substrate, encapsulating the LED onto the substrate.

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least one CLD is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least two CLDs coupled in parallel, is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: A discontinuity-containing, light-diffusing substrate is placed within an LED light source. In one embodiment, the substrate is placed between an LED light source and a light guide. The light diffusing substrate may include a plurality of air bubbles, grooves or both, effective to mix the colored light and yield a white light exiting the light guide. Methods of constructing optical devices and light sources having a bubble-containing substrate are also disclosed.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.

Abstract: A light source that has improved light mixing. The light source uses a nanolens layer in conjunction with an LED light source to enhance the mixing of the colored light emitting from the LED light source.

Abstract: A lighting apparatus is described. One embodiment of the lighting apparatus includes a substrate and a lighting element. The lighting element is coupled to the substrate to emit light through a light exit plane. The light exit plane is substantially perpendicular to the substrate. By providing a lighting device with a substrate oriented perpendicular to the light exit plane of the lighting device, the lighting device can enable better mixing of the light from different LEDs. The lighting apparatus facilitates light mixing, generally, to minimize or eliminate dark spots on the diffusion panel. The lighting device also facilitates color mixing to produce relatively consistent white light on the diffusion panel.

Abstract: A light emitting device is disclosed herein. An embodiment of the light emitting device includes a cavity and at least one light emitter located within the cavity. A first transparent material fills at least a portion of the cavity and encapsulates the light emitter. A substantially rigid optical modifying element is located adjacent the first transparent material, the modifying element comprises particles that emit at least one first wavelength of light upon being illuminated by a second wavelength of light. The modifying element has a first side located adjacent the first transparent material and a second side located opposite the first side, wherein the first side is substantially flat. In addition, the modifying element is substantially uniform in thickness.

Abstract: Illumination devices (10), systems and methods that convert an alternating current (AC) supply (14) to a direct current (DC) for powering a plurality of light emitting diodes (LEDs) are disclosed. An illumination device (10) comprises a full wave rectifier (12) for converting the AC supply into a direct current (DC). A current limiting diode (CLD) module (16), comprising at least two CLDs coupled in parallel, is coupled in series to an output of the full wave rectifier and a light emitting diode (LED) module (18) comprising a plurality of LEDs is coupled in series between an output of the CLD module (16) and the full wave rectifier (12).

Abstract: A lighting system is described. One embodiment of the lighting system includes a light guide, a first lighting device, and a second lighting device. The light guide receives light along a transmission interface. The first lighting device has a first plurality of lighting elements coupled to a first substrate between a first pair of reflector walls. The first substrate and the first pair of reflector walls define a first exposed side of the first lighting device. The second lighting device has a second plurality of lighting elements coupled to a second substrate between a second pair of reflector walls. The second substrate and the second pair of reflector walls define a second exposed side of the second lighting device configured to match the first exposed side of the first lighting device. Using lighting devices without sidewalls illuminates a diffusion panel so that there are no dark spots.

Abstract: A light source having a flexible substrate and a plurality of dies having LEDs is disclosed. The light source can be conveniently utilized to provide an extended light source by bonding the light source to a suitable light pipe. The substrate is divided into first and second regions. The dies are bonded to the substrate in a first region. A portion of the surface of the substrate in the second region is reflective. The substrate is bent such that the second region forms a reflector that reflects light that would otherwise be emitted in a non-useful direction to a more useful direction. The substrate can be constructed from a three layer flexible circuit carrier in which the dies are mounted on a bottom metal layer to provide an improved thermal path for heat generated in the dies.

Abstract: The present invention is directed to a dimensionally-stable electronic device such as an LED on flexible printed-circuit-board. The device comprises an electrically-conductive flexible substrate and at least one stabilizing component for dimensionally stabilizing the substrate.

Abstract: A light source having a die, a substrate, and a housing is disclosed. The die has a semiconducting light emitting device thereon, the die having a top surface and a bottom surface, light being emitted through the top surface. The die is characterized by a maximum dimension. The substrate has a top surface bonded to the bottom surface of the die. The substrate includes a plurality of electrical traces connected to the die that are used to power the light emitting device. The housing includes a reflector having a reflective inner wall facing the die and an aperture through which light reflected from the inner wall exits the housing. The aperture lies in a plane normal to the top surface of the die and has a height that is less than the maximum dimension of the die. The die is encapsulated in a transparent layer of material.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.