Patents by Inventor Tong-Jung Wang
Tong-Jung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11817388Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.Type: GrantFiled: June 28, 2022Date of Patent: November 14, 2023Assignee: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Publication number: 20230083007Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.Type: ApplicationFiled: November 17, 2022Publication date: March 16, 2023Applicant: Innolux CorporationInventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma
-
Publication number: 20220328405Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.Type: ApplicationFiled: June 28, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Publication number: 20220328406Abstract: The disclosure provides an electromagnetic wave adjustment apparatus includes a control circuit, a transistor circuit die and an electronic assembly. The transistor circuit die receives a control signal from the control circuit and drives the electronic assembly.Type: ApplicationFiled: June 28, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Publication number: 20220181257Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.Type: ApplicationFiled: February 23, 2022Publication date: June 9, 2022Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Patent number: 11302635Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.Type: GrantFiled: July 3, 2020Date of Patent: April 12, 2022Assignee: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Patent number: 11112636Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.Type: GrantFiled: September 23, 2020Date of Patent: September 7, 2021Assignee: Innolux CorporationInventors: Chia-Chieh Fan, Tong-Jung Wang
-
Publication number: 20210259103Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.Type: ApplicationFiled: January 22, 2021Publication date: August 19, 2021Applicant: Innolux CorporationInventors: Jia Sin Li, Tong-Jung Wang, Chia-Chieh Fan, Shan Shan Hsu, Chih Han Ma
-
Publication number: 20210109389Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.Type: ApplicationFiled: September 23, 2020Publication date: April 15, 2021Applicant: Innolux CorporationInventors: Chia-Chieh Fan, Tong-Jung Wang
-
Publication number: 20210035909Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.Type: ApplicationFiled: July 3, 2020Publication date: February 4, 2021Applicant: Innolux CorporationInventors: Tang Chin Hung, Chin-Lung Ting, Chung-Kuang Wei, Ker-Yih Kao, Tong-Jung Wang, Chih-Yung Hsieh, Hao Jung Huang, I-Yin Li, Chia-Chi Ho, Yi Hung Lin, Cheng-Hsu Chou, Chia-Ping Tseng
-
Patent number: 10825787Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 ?m and less than or equal to 14 ?m. In addition, the disclosure further provides an electronic device including the first electronic element.Type: GrantFiled: October 1, 2018Date of Patent: November 3, 2020Assignee: Innolux CorporationInventors: Wei-Cheng Chu, Ming-Fu Jiang, Chia-Cheng Liu, Tong-Jung Wang
-
Patent number: 10820425Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.Type: GrantFiled: June 20, 2019Date of Patent: October 27, 2020Assignee: Innolux CorporationInventors: Wei-Cheng Chu, Chia-Cheng Liu, Chih-Yuan Lee, Chin-Lung Ting, Tong-Jung Wang
-
Patent number: 10553150Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.Type: GrantFiled: September 17, 2018Date of Patent: February 4, 2020Assignee: INNOLUX CORPORATIONInventors: Chia-Chieh Fan, Wen-Chieh Lin, Tong-Jung Wang
-
Patent number: 10488690Abstract: A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.Type: GrantFiled: August 20, 2018Date of Patent: November 26, 2019Assignee: INNOLUX CORPORATIONInventors: Chih-Chiao Yang, Chia-Chun Yang, Chin-Cheng Kuo, Tong-Jung Wang
-
Publication number: 20190306990Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.Type: ApplicationFiled: June 20, 2019Publication date: October 3, 2019Applicant: Innolux CorporationInventors: Wei-Cheng Chu, Chia-Cheng Liu, Chih-Yuan Lee, Chin-Lung Ting, Tong-Jung Wang
-
Publication number: 20190148320Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 ?m and less than or equal to 14 ?m. In addition, the disclosure further provides an electronic device including the first electronic element.Type: ApplicationFiled: October 1, 2018Publication date: May 16, 2019Inventors: Wei-Cheng CHU, Ming-Fu JIANG, Chia-Cheng LIU, Tong-Jung WANG
-
Publication number: 20190114957Abstract: A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.Type: ApplicationFiled: September 17, 2018Publication date: April 18, 2019Inventors: Chia-Chieh FAN, Wen-Chieh LIN, Tong-Jung WANG
-
Publication number: 20190072810Abstract: A display device includes a display panel, a first frame, a second frame and an adhesive element. The first frame is disposed corresponding to the display panel and includes a bottom portion and a side wall. The bottom portion is connected to the side wall. The second frame is disposed on the first frame. The display panel is disposed on a part of the second frame. The adhesive element is disposed between the first frame and the second frame. The adhesive element contacts at least a part of the bottom portion and at least a part of the side wall. An assembling method of the display device is also provided.Type: ApplicationFiled: August 20, 2018Publication date: March 7, 2019Inventors: Chih-Chiao YANG, Chia-Chun YANG, Chin-Cheng KUO, Tong-Jung WANG
-
Publication number: 20180270961Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.Type: ApplicationFiled: March 12, 2018Publication date: September 20, 2018Applicant: Innolux CorporationInventors: Wei-Cheng Chu, Chia-Cheng Liu, Chih-Yuan Lee, Chin-Lung Ting, Tong-Jung Wang
-
Publication number: 20050184324Abstract: A storage capacitor structure comprising a first capacitor electrode on a substrate, a capacitor dielectric layer on the first capacitor electrode and a second capacitor electrode on the capacitor dielectric layer, a passivation layer on the second capacitor electrode and a pixel electrode layer on the passivation layer. The second capacitor electrode has an area smaller than the first capacitor electrode. The passivation layer has an opening that exposes a portion of the second capacitor electrode. The pixel electrode layer and the second capacitor electrode are electrically connected through the opening in the passivation layer.Type: ApplicationFiled: March 30, 2005Publication date: August 25, 2005Inventors: Yuan-Liang Wu, Tong-Jung Wang, Chin-Jung Kuo