Patents by Inventor Tong Wa Chao

Tong Wa Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
    Publication number: 20230420338
    Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.
    Type: Application
    Filed: March 6, 2021
    Publication date: December 28, 2023
    Inventors: Prabhakar SUBRAHMANYAM, Tong Wa CHAO, Ying-Feng PANG, Yi XIA, Rahima K. MOHAMMED, Victor P. POLYANKO, Ridvan A. SAHAN, Guangying ZHANG, Guoliang YING, Chuanlou WANG, Jun LU, Liguang DU, Peng WEI, Xiang QUE
  • THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS
    Publication number: 20220225542
    Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Tong Wa CHAO, Mark BIANCO, Yanbing SUN, Ming ZHANG, Guixiang TAN, Devdatta P. KULKARNI, Guocheng ZHANG, Hao ZHOU
  • Integrated circuit package having bottom-side stiffener
    Patent number: 8952511
    Abstract: Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: February 10, 2015
    Assignee: Intel Corporation
    Inventors: Ajit V. Sathe, Mat J. Manusharow, Tong Wa Chao
  • Heat spreader for a multi-chip package
    Patent number: 7944046
    Abstract: Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: May 17, 2011
    Assignee: Intel Corporation
    Inventor: Tong Wa Chao
  • Heat Spreader for a multi-chip package
    Publication number: 20090219698
    Abstract: Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: May 8, 2009
    Publication date: September 3, 2009
    Inventor: Tong Wa Chao
  • INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER
    Publication number: 20090152738
    Abstract: Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Inventors: Ajit V. Sathe, Mat J. Manusharow, Tong Wa Chao
  • Heat spreader for a multi-chip package
    Publication number: 20080128897
    Abstract: Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 5, 2008
    Inventor: Tong Wa Chao