Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Abstract: The invention discloses an unmanned aerial vehicle having multifunctional leg assembly and charging system, including unmanned aerial vehicle and charging station. The UAV includes obstacle avoidance sensors, flight control module, first signal processing module, electric undercarriage and power charge/storage module. The charging station includes power charge/supply module. The obstacle avoidance sensors sense obstacles near the UAV to generate obstacle sensing signals. The first signal processing module interprets and processes the obstacle sensing signals to determine whether there is an obstacle near the UAV, and when the judgment result is yes, an avoidance instruction is transmitted to the flight control module, so that the flight control module drives the UAV to avoid the obstacle. The electric undercarriage includes first leg frame, second leg frame and electric driving mechanism. The electric driving mechanism drives the first leg frame and the second leg frame to fold and unfold alternately.

Abstract: The present invention discloses a circuit substrate including an insulation layer; a metal layer disposed on a first surface of the insulation layer; and a first solder pad and a second solder pad disposed on a second surface of the insulation layer opposite the metal layer. Shortest distances between soldering dots on the metal layer and a projected area of the first solder pad on the metal layer are shorter than a distance threshold, the shortest distance being a minimum value of vertical distances between each of the soldering dots on the metal layer and a side edge of the projected area of the first solder pad on the metal layer. The soldering dots on the metal layer correspond one-to-one to soldering dots on a corresponding die; and the side edge is adjacent to a projected area of the second solder pad on the metal layer.

Abstract: A precision agriculture implementation method by UAV systems and artificial intelligence image processing technologies provides an unmanned aerial vehicle (UAV), a wireless communication device, a central control unit, and a spray device and a multispectral camera installed to the UAV. The farming area is divided into an array of blocks. The central control unit controls the UAV to fly over the blocks according to navigation parameters and the multispectral camera to capture a multispectral image of each block. A projected leaf area index (PLAI) and a normalized difference vegetation index (NDVI) of each block are calculated by the multispectral image, and a spray control mode of the spray device of the corresponding block is set according to the PLAI and NDVI. The spray device is controlled to spray a water solution, salt solution, fertilizer solution, and/or pesticide solution to the corresponding block according to the spray control mode.

Abstract: A power stage circuit and a calculation board. The power stage circuit includes an input circuit and an output circuit. The input circuit and the output circuit are electrically connected. The power stage circuit also includes a plurality of package pins. The plurality of package pins are respectively connected to the input circuit, the output circuit, and a power supply package unit.

Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.

Abstract: The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Abstract: The embodiments of the present disclosure discloses a circuit substrate, a chip, a series circuit, a circuit board, and an electronic device. The circuit substrate includes: an insulation layer; a metal layer disposed on a first surface of the insulation layer; and a first soldering pad and a second soldering pad disposed on a second surface of the insulation layer facing away from the metal layer. Shortest distances between soldering dots on the metal layer and a projected area of the first soldering pad on the metal layer are all smaller than a distance threshold. The soldering dots on the metal layer are one-to-one corresponding to soldering dots on a corresponding die. Compared with the existing technology, in the embodiments of the present disclosure, distances between the soldering dots on the metal layer and the projected area of the first soldering pad on the metal layer are substantially short, and a corresponding resistance is substantially small.

Abstract: A precision agriculture implementation method by UAV systems and artificial intelligence image processing technologies provides an unmanned aerial vehicle (UAV), a wireless communication device, a central control unit, and a spray device and a multispectral camera installed to the UAV. The farming area is divided into an array of blocks. The central control unit controls the UAV to fly over the blocks according to navigation parameters and the multispectral camera to capture a multispectral image of each block. A projected leaf area index (PLAI) and a normalized difference vegetation index (NDVI) of each block are calculated by the multispectral image, and a spray control mode of the spray device of the corresponding block is set according to the PLAI and NDVI. The spray device is controlled to spray a water solution, salt solution, fertilizer solution, and/or pesticide solution to the corresponding block according to the spray control mode.

Abstract: A heat sink for an integrated circuit chip. The heat sink includes a base plate and a plurality of fins connected to the base plate. The base plate includes a first segment, a second segment, and a third segment that are sequentially connected; and the first segment and the third segment extend obliquely upward relative to the second segment.

Abstract: A power stage circuit and a calculation board. The power stage circuit includes an input circuit and an output circuit. The input circuit and the output circuit are electrically connected. The power stage circuit also includes a plurality of package pins. The plurality of package pins are respectively connected to the input circuit, the output circuit, and a power supply package unit.

Abstract: Certain embodiments herein are directed to systems and methods to predict failures in power systems equipment. In one embodiment, one or more life-span models associated with power systems equipment may be received. Examples of such life-span models may include a left-censoring model, a right-censoring model, and an interval-censoring model. An accuracy of the life-span models may be determined based at least in part on statistical analysis, such as a Weibull distribution analysis. A stability of the life-span models may also be determined, in certain embodiments herein.

Abstract: Systems and methods are disclosed herein for enhancing turbomachine operations. Such systems and methods include a hybrid risk model. The hybrid risk model includes a physics-based sub model and a statistical sub model. The physics-based sub model is configured to model physical components of a turbomachine. The statistical sub model is configured to model historical information of the turbomachine. The hybrid risk model is configured to calculate a turbomachine parameter.

Abstract: Certain embodiments herein are directed to systems and methods to predict failures in power systems equipment. In one embodiment, one or more life-span models associated with power systems equipment may be received. Examples of such life-span models may include a left-censoring model, a right-censoring model, and an interval-censoring model. An accuracy of the life-span models may be determined based at least in part on statistical analysis, such as a Weibull distribution analysis. A stability of the life-span models may also be determined, in certain embodiments herein.

Abstract: An embodiment of the invention provides an apparatus for measuring a conductive pattern on a substrate, which includes a first electro-optical modulator surrounding at least one first detecting roller; transmission rollers for transferring the substrate and allowing direct contact of the substrate and the first electro-optical modulator; a voltage supplier for providing a bias between the first electro-optical modulator and the substrate; and a first image detecting system for receiving a first detecting light reflected from a first surface of the substrate.

Abstract: The disclosure relates to an electro optical sensor, which comprises a light source generating device, an electro optical modulator, a supporting module, and an image capturing module. The light source generating device emits a light beam. After the electro optical modulator modulates the light beam, the modulated light beam emits onto a subject. The supporting module includes a transparent substrate, supporting the subject and allowing the modulated light beam to incidentally emit into the transparent substrate. The image capturing module converts the light beam reflected from the supporting module into a video signal.

Abstract: Systems and methods are disclosed herein for enhancing turbomachine operations. Such systems and methods include a hybrid risk model. The hybrid risk model includes a physics-based sub model and a statistical sub model. The physics-based sub model is configured to model physical components of a turbomachine. The statistical sub model is configured to model historical information of the turbomachine. The hybrid risk model is configured to calculate a turbomachine parameter.

Abstract: An embodiment of the invention provides an apparatus for measuring a conductive pattern on a substrate, which includes: a first electro-optical modulator surrounding at least one first detecting roller; transmission rollers for transferring the substrate and allowing direct contact of the substrate and the first electro-optical modulator; a voltage supplier for providing a bias between the first electro-optical modulator and the substrate; and a first image detecting system for receiving a first detecting light reflected from a first surface of the substrate.

Abstract: A exemplary method for determining vibration displacement in interferometric scanning, in which two optical signals having a phase difference with each other of a high-coherence interferogram corresponding to a tested surface is detected for determining a shifting displacement between the reference plane of interferometric apparatus and the tested surface. In one embodiment, a series of the shifting displacements with respect to a time interval are measured for determining the vibrating frequency of the tested surface by spectrum analysis. Meanwhile, an exemplary interferometric apparatus is also disclosed for calculating the relative position between the tested surface and the reference plane of interferometric apparatus whereby the interferometric apparatus is capable of compensating influences of vibration caused by the environment or the tested surface itself so as to obtain the surface profile and vibration frequency of the tested surface.