Abstract: An image sensor package includes an image sensor having an active area, a window, and a window support in contact with the active area and in contact with the window. The window support entirely encloses, and thus protects, the active area of the image sensor. During use, radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. By forming the window and the window support to have a similar refractive index, the amount of reflected radiation is minimized thus enhancing the sensitivity of the image sensor package. Further, the window support completely fills the region between the window and the active area thus eliminating any possibility of moisture condensation within the image sensor package.

Abstract: A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. The window and the window support are transparent to the radiation.

Abstract: To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.

Abstract: An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.