Patents by Inventor Tony B. Shaffer

Tony B. Shaffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110223232
    Abstract: The invention is generally directed to a drug-release composition that contains drug-linker-drug compound that is combined with another therapeutic agent that can be an antirestenotic agent. The therapeutic agent can be partially bound to the drug-linker-drug compound, miscible with the drug-linker-drug compound, combined with the drug-linker-drug compound at various ratios, and tuned to control the release of drugs to a tissue in need thereof.
    Type: Application
    Filed: October 23, 2007
    Publication date: September 15, 2011
    Inventors: Olexander Hnojewyj, Patrick Rivelli, JR., Tony B. Shaffer, David Cheung
  • Publication number: 20080014170
    Abstract: The disclosure is generally directed to a biodegradable polymer composition comprising a drug-containing polymer component having a backbone containing one or more therapeutic drugs that are linked together by anhydride linkages, such that molecules of the drug are released upon biodegradation of the component. The biodegradable polymer composition also comprises a polyester-based polymer component.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventors: Olexander Hnojewyj, Patrick Rivelli, Tony B. Shaffer
  • Patent number: 6214152
    Abstract: Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those locations where the surfaces of the leads will interface with the enclosure material, molding the package around the leads, and curing the adhesive during the molding process or during a post-cure. The adhesive is formulated to form a gas-tight seal around the leads and to maintain the seal during the thermal cycling that the components are exposed to during the typical procedures involved in manufacturing the packages and in making the electrical connections to other circuitry, as well as the typical environmental changes that the finished and installed product is exposed to during use.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: April 10, 2001
    Assignee: RJR Polymers, Inc.
    Inventors: Richard J. Ross, Cynthia L. Ross, Tony B. Shaffer, John Qiang Ni