Patents by Inventor Tony Beier

Tony Beier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Physical vapor deposition target constructions
    Patent number: 6797362
    Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: September 28, 2004
    Assignee: Honeywell International Inc.
    Inventors: Chris Parfeniuk, Tony Beier
  • Methods of bonding physical vapor deposition target materials to backing plate materials
    Patent number: 6780794
    Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: August 24, 2004
    Assignee: Honeywell International Inc.
    Inventors: Chris Parfeniuk, Tony Beier
  • Methods of bonding first and second masses to one another, and methods of bonding physical vapor deposition target materials to backing plate materials
    Publication number: 20020039810
    Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.
    Type: Application
    Filed: January 20, 2000
    Publication date: April 4, 2002
    Inventors: Chris Parfeniuk, Tony Beier
  • Physical Vapor Deposition Target Constructions
    Publication number: 20020028538
    Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.
    Type: Application
    Filed: August 9, 2001
    Publication date: March 7, 2002
    Inventors: Chris Parfeniuk, Tony Beier