Patents by Inventor TONY C. KANG

TONY C. KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating and Electrophoretic Deposition over Surfaces of Metal Substrate
    Publication number: 20180305822
    Abstract: Various examples described herein provide for a substrate, or a method for preparing a substrate, including a first electroplated layer disposed over a metal substrate, a second electroplated layer disposed under the metal substrate, and an electrophoretic deposition layer disposed over the first electroplated layer.
    Type: Application
    Filed: May 6, 2015
    Publication date: October 25, 2018
    Inventors: CHALAM KASHYAP, KUAN-TING WU, TONY C. KANG