Abstract: An apparatus includes a socket that receives a memory module that includes a card having card edge voltage pads along the lower card edge, auxiliary voltage pads along at least one of the vertical card edges, and one or more persistent, solid-state memory chips on one or both card faces. A latch pivotally coupled to the socket is movable between a latched position and an unlatched position. The latch includes electrical latch contacts positioned for being engaged with the auxiliary voltage pads when that latch is in the latched position and being disengaged from the auxiliary voltage pads when the latch is in the unlatched position. The electrical latch contacts may provide a different voltage to the auxiliary voltage pads than the socket provides to the card edge voltage pads along the lower card edge.

Abstract: A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage connector on the memory module to provide power to the persistent-storage memory chips. The auxiliary power cable also resists movement of a latch lever to require disconnecting the auxiliary power cable before ejecting the memory module.

Abstract: A memory module connector includes a dynamically-assisted latch that facilitates connecting and releasing a memory module. The latch includes a lever pivotably coupled to the connector for urging the memory module into and out of a fully seated position within the connector. The lever provides a mechanical advantage for lowering and raising the memory module. A latch assist member urges the latch into engagement with the memory module in response to an insertion of the memory module, and dynamically positions the lever in response to movement of the memory module within the connector.

Abstract: An electronic component is connected to a circuit board by forming a connector pin on the electronic component, the connector pin having a proximate end secured to the electronic component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through-hole is formed on a circuit board having a circuit board thickness greater than a length of the connector pin, with a first portion that is narrower than each of the compliant portion and the fork lock and extends partially through the circuit board and a second portion that extends beyond the first portion and is wider than the first portion. The connector pin is inserted into the first portion of the through-hole and the fork lock is moved beyond the first portion into the second portion of the through-hole.

Abstract: A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.

Abstract: A memory module connector includes a dynamically-assisted latch that facilitates connecting and releasing a memory module. The latch includes a lever pivotably coupled to the connector for urging the memory module into and out of a fully seated position within the connector. The lever provides a mechanical advantage for lowering and raising the memory module. A latch assist member urges the latch into engagement with the memory module in response to an insertion of the memory module, and dynamically positions the lever in response to movement of the memory module within the connector.

Abstract: A pin and a method of establishing contact between a pin and plating of a circuit board hole is provided. Embodiments include a pin comprising a pair of outwardly biased flexible beams that each extend from a body of the pin, the flexible beams connected at one end to one another at the body of the pin and separated from each other at an end opposite the end connected to the body, the separation between the pair of flexible beams forming an open slot, each flexible beam including a contact point that contacts the plating of the hole when the pin is inserted into the circuit board hole.

Abstract: An edge connector is provided that accommodates printed circuit boards (PCB) of varying thickness. Embodiments include a body; a set of card connector engagement pins coupled to the body, the set of card connector engagement pins coupling with a circuit card connector; and the set of PCB engagement pins coupled to the body, the set of PCB engagement pins receiving contact pads of the PCB, wherein each PCB engagement pin includes a contact point that slopes away from the body of the edge connector, wherein the contact point of each PCB engagement pin slopes in an opposite direction from the contact point of the other PCB engagement pin in the set, wherein each PCB engagement pin is flexible inward toward the body of the edge connector.

Abstract: An active electrical connection system includes a first connector, a second connector for releasably connecting with the first connector, active circuitry for affecting a data signal, and a heat sink for dissipating heat. A heat sink positioning system comprising a plurality of protrusions and corresponding recesses precisely positions the heat sink during insertion to prevent sliding contact with a thermal interface material applied between the heat sink and a plug.

Abstract: A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.

Abstract: A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Abstract: A low resistance, multi-contact point pin, configured for insertion into a pin receptacle having an electrically conductive plating, where the pin includes: a surface and more than one electrically conductive extrusion from the surface of the pin, with each extrusion extruding substantially orthogonal to a direction of insertion of the pin into the pin receptacle, and where the extrusions configured to electrically couple, with parallel resistance, the pin to the electrically conductive plating of the pin receptacle.

Abstract: A pin and a method of establishing contact between a pin and plating of a circuit board hole is provided. Embodiments include a pin comprising a pair of outwardly biased flexible beams that each extend from a body of the pin, the flexible beams connected at one end to one another at the body of the pin and separated from each other at an end opposite the end connected to the body, the separation between the pair of flexible beams forming an open slot, each flexible beam including a contact point that contacts the plating of the hole when the pin is inserted into the circuit board hole.

Abstract: An edge connector is provided that accommodates printed circuit boards (PCB) of varying thickness. Embodiments include a body; a set of card connector engagement pins coupled to the body, the set of card connector engagement pins coupling with a circuit card connector; and the set of PCB engagement pins coupled to the body, the set of PCB engagement pins receiving contact pads of the PCB, wherein each PCB engagement pin includes a contact point that slopes away from the body of the edge connector, wherein the contact point of each PCB engagement pin slopes in an opposite direction from the contact point of the other PCB engagement pin in the set, wherein each PCB engagement pin is flexible inward toward the body of the edge connector.

Abstract: A socket receptive to insertion of an integrated circuit (IC) printed circuit board (PCB) includes a housing, conductors, and vents. The housing has first and second sides corresponding to a length of the IC PCB. The conductors are mounted within the housing to mate with corresponding conductors of the IC PCB upon insertion of the IC PCB into the housing, and have leads adapted to being soldered to corresponding conductors of a host PCB. The vents are within the housing and are adapted to dissipate heat resulting from soldering the leads to the host PCB to minimize warping of the housing during soldering. The vents are further adapted to compensate for a mismatch between a coefficient of thermal expansion (CTE) of the housing and a CTE of the host PCB during soldering, regardless of the CTE of the host PCB.

Abstract: A scalability card for use with a plurality of computer blades. The computer blades are releasably securable in a parallel configuration, wherein each blade includes a circuit board and a processor operatively coupled to the circuit board. Each processor is in electronic communication with a scalability connector on a floating plate that is loosely secured to the computer blade. Furthermore, each scalability connector is preferably disposed in a common plane extending perpendicular to the plurality of parallel computer blades. The scalability card includes a plurality of electronically interconnected scalability connectors arranged for rough alignment with the scalability connectors of each computer blade. In addition, the scalability card preferably includes at least one alignment feature for engaging each floating plate and, therefore, providing fine alignment of the scalability connector on each floating plate to one of the scalability connectors of the scalability card.

Abstract: A data storage library includes a drive enclosure bay which can be adapted to work with multiple air-flow configuration requirements. This is accomplished by creating air-flow ports in the top and bottom of the drive enclosure bay, by forming drive tray slots and printed circuit board ports in associated drive trays, by creating frame ports and PCB notches in associated interface cards, and replacing traditional connectors with slimmer but longer connectors that provide additional standoff and improved air-flow.

Abstract: A socket for receiving a memory module is provided and includes a receiving area having a plurality of socket contacts for making contact with a plurality of memory module contacts and a set of guiding tracks disposed at each end of the socket, wherein the guiding tracks including at least one feature for retaining the memory module once the memory module is dismounted from the socket. A method for fabricating the socket is provided.

Abstract: A floating connector spring capable of movement in multiple degrees of freedom to enable the mating of at least two connectors that may be misaligned relative to one another. The connector spring includes first and second arms spaced form one another and extending substantially in the same direction. The first and second arms each have a lobe section between their distal and proximal ends, which are resiliently deformable to allow movement of the distal ends relative to the proximal ends of the respective arms. The movement permitted includes linear and rotational movement in up to six degrees of freedom depending on the configuration of the invention used. The connector spring can further include a third arm extending perpendicular from the first and second arms and which includes a third lobe section for movement in an additional degree of freedom.