Abstract: A wafer processing system includes a single-wafer load lock with integrated cooling unit. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By integrating a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling unit before moving the wafer to the load lock.

Abstract: A wafer processing system employing a single-wafer load lock with a cooling unit is disclosed. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By providing a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling station before moving the wafer to the load lock. In another embodiment, the wafer processing system includes a load lock having the capability to both heat and cool a wafer. This further increases throughput in processes where the wafer needs to be pre-heated before putting the wafer in the reactor by eliminating the need for an intermediate pre-heating station.