Patents by Inventor Tony Kean-Lee Lim

Tony Kean-Lee Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias
    Patent number: 5936848
    Abstract: An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partially located over the opening. The solder ball has first and second opposed sides, the first side being adjacent the first wall and the second side being adjacent the second wall. The first side is nearer to the first wall than the second side is to the second wall.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: August 10, 1999
    Assignee: Intel Corporation
    Inventors: Behrooz Mehr, Tony Kean-Lee Lim, Agnes Seok-Tuan Lim, Michael Barrow