Patents by Inventor Tony Luong
Tony Luong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7018276Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.Type: GrantFiled: June 25, 2004Date of Patent: March 28, 2006Assignee: Lam Research CorporationInventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
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Patent number: 6896586Abstract: A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.Type: GrantFiled: March 29, 2002Date of Patent: May 24, 2005Assignee: Lam Research CorporationInventors: Xuyen Pham, Tuan Nguyen, Ren Zhou, David Wei, Linda Jiang, Katgenhalli Y. Ramanujam, Joseph P. Simon, Tony Luong, Sridharan Srivatsan, Anjun Jerry Jin
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Patent number: 6896600Abstract: A liquid dispense manifold having drip nozzles configured to form controlled droplets is provided for use in chemical-mechanical polisher (CMP) systems. The liquid dispense manifold includes a plurality of drip nozzles that are secured to the side of the liquid dispense manifold. Each of the plurality of drip nozzles has a passage defined between a first end and a second end. A bend is defined within the drip nozzle passage such that droplets are directed downward toward a polishing surface. The nozzles are configured with respect to the manifold to provide an even flow rate of substantially uniform drops onto the polishing surface.Type: GrantFiled: March 29, 2002Date of Patent: May 24, 2005Assignee: LAM Research CorporationInventors: Patrick P. H. Wu, Xuyen Pham, Tony Luong
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Publication number: 20040242136Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.Type: ApplicationFiled: June 25, 2004Publication date: December 2, 2004Applicant: Lam Research CorporationInventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
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Publication number: 20040161939Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.Type: ApplicationFiled: February 10, 2004Publication date: August 19, 2004Applicant: Lam Research CorporationInventors: Anthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
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Patent number: 6761626Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.Type: GrantFiled: December 20, 2001Date of Patent: July 13, 2004Assignee: Lam Research CorporationInventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
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Patent number: 6712670Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.Type: GrantFiled: December 27, 2001Date of Patent: March 30, 2004Assignee: Lam Research CorporationInventors: Anthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
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Patent number: 6666755Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.Type: GrantFiled: June 26, 2002Date of Patent: December 23, 2003Assignee: Lam Research CorporationInventors: Travis R. Taylor, Christian DiPietro, Stephen Jew, Philip Ngoon, Katgenahalli Y. Ramanujam, Tony Luong
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Publication number: 20030186623Abstract: A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.Type: ApplicationFiled: March 29, 2002Publication date: October 2, 2003Applicant: LAM Research Corp.Inventors: Xuyen Pham, Tuan Nguyen, Ren Zhou, David Wei, Linda Jiang, Katgenhalli Y. Ramanujam, Joseph P. Simon, Tony Luong, Sridharan Srivatsan, Anjun Jerry Jin
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Publication number: 20030139115Abstract: An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.Type: ApplicationFiled: December 27, 2001Publication date: July 24, 2003Applicant: LAM RESEARCH CORPORATIONInventors: Anthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
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Publication number: 20030119433Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.Type: ApplicationFiled: December 20, 2001Publication date: June 26, 2003Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong