Patents by Inventor Tony M. Berry

Tony M. Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10136529
    Abstract: A method of making a power module includes providing a base plate defining a topology pattern, providing a power substrate above the base plate, providing at least two power contacts and arranging solder catches in the at least two power contacts, soldering the at least two power contacts to the power substrate utilizing the solder catches, and securing a housing to the power substrate.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: November 20, 2018
    Assignee: Cree Fayetteville, Inc.
    Inventors: Brice McPherson, Peter Killeen, Alex Lostetter, Robert Shaw, Brandon Passmore, Jared Hornberger, Tony M. Berry
  • Publication number: 20160353590
    Abstract: A method of making a power module includes providing a base plate defining a topology pattern, providing a power substrate above the base plate, providing at least two power contacts and arranging solder catches in the at least two power contacts, soldering the at least two power contacts to the power substrate utilizing the solder catches, and securing a housing to the power substrate.
    Type: Application
    Filed: August 15, 2016
    Publication date: December 1, 2016
    Inventors: Brice McPherson, Peter Killeen, Alex Lostetter, Robert Shaw, Brandon Passmore, Jared Hornberger, Tony M. Berry
  • Patent number: 9426883
    Abstract: A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: August 23, 2016
    Assignee: Cree Fayetteville, Inc.
    Inventors: Brice McPherson, Peter D. Killeen, Alex Lostetter, Robert Shaw, Brandon Passmore, Jared Hornberger, Tony M. Berry
  • Publication number: 20150216067
    Abstract: A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.
    Type: Application
    Filed: January 30, 2015
    Publication date: July 30, 2015
    Applicant: Arkansas Power Electronics International, Inc.
    Inventors: Brice McPherson, Peter D. Killeen, Alex Lostetter, Robert Shaw, Brandon Passmore, Jared Hornberger, Tony M. Berry