Patents by Inventor Tony Opheim

Tony Opheim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling devices in semiconductor packages
    Patent number: 8164169
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: April 24, 2012
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, Tony A. Opheim
  • COOLING DEVICES IN SEMICONDUCTOR PACKAGES
    Publication number: 20110135015
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Application
    Filed: November 1, 2010
    Publication date: June 9, 2011
    Inventors: Gregory M. Chrysler, Tony A. Opheim
  • Covered devices in a semiconductor package
    Patent number: 7825503
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: November 2, 2010
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, Tony A. Opheim
  • COVERED DEVICES IN A SEMICONDUCTOR PACKAGE
    Publication number: 20090289353
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Application
    Filed: July 27, 2009
    Publication date: November 26, 2009
    Applicant: INTEL CORPORATION
    Inventors: Gregory M. Chrysler, Tony A. Opheim
  • Covered devices in a semiconductor package
    Patent number: 7622327
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: November 24, 2009
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, Tony A. Opheim
  • Covered devices in a semicoductor package
    Publication number: 20070231969
    Abstract: An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 4, 2007
    Inventors: Gregory Chrysler, Tony Opheim
  • Providing a via with an increased via contact area
    Patent number: 7183654
    Abstract: An apparatus and method to provide a via with an increased via contact area. A semiconductor support layer is coupled to a dielectric layer and a contact is coupled to the dielectric layer. A via, having an enlarged end within the semiconductor support layer, passes through the semiconductor support layer and the dielectric layer and connects to the contact. In one embodiment, the formation of the via and the enlarged end in the semiconductor support layer are completed in a single dry etch process.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: February 27, 2007
    Assignee: Intel Corporation
    Inventor: Tony A. Opheim
  • Providing a via with an increased via contact area
    Publication number: 20050067711
    Abstract: An apparatus and method to provide a via with an increased via contact area. A semiconductor support layer is coupled to a dielectric layer and a contact is coupled to the dielectric layer. A via, having an enlarged end within the semiconductor support layer, passes through the semiconductor support layer and the dielectric layer and connects to the contact. In one embodiment, the formation of the via and the enlarged end in the semiconductor support layer are completed in a single dry etch process.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventor: Tony Opheim