Patents by Inventor Tony Pan
Tony Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9605806Abstract: A method of transporting liquefied breathing gases in underground mines includes providing a conduit system that extends within a mine shaft to a work space below ground where the conduit system includes an outlet positioned in the work space, delivering liquefied breathing gases through the conduit system, and vaporizing the liquefied breathing gases at the outlet of the conduit system.Type: GrantFiled: July 19, 2012Date of Patent: March 28, 2017Assignee: Elwha LLCInventors: Michael H. Baym, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Conor L. Myhrvold, Nathan P. Myhrvold, Tony Pan, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, Jr., Victoria Y. H. Wood
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Publication number: 20160030721Abstract: Devices, methods, and compositions are described that includes an implantable device including one or more compartments. One or more pharmaceutically effective compounds stabilized in a sugar glass composition, at least one of the one or more stabilized pharmaceutically effective compounds in the sugar glass composition enclosed within the one or more compartments; and one or more reservoirs configured to provide access for one or more release agents to an interior of the sugar glass composition, wherein the one or more reservoirs are configured to controllably dispense the one or more release agents to disrupt the sugar glass composition from the interior of the sugar glass composition.Type: ApplicationFiled: October 13, 2015Publication date: February 4, 2016Inventors: Roderick A. Hyde, Jordin T. Kare, Gary L. McKnight, Nathan P. Myhrvold, Tony Pan, Elizabeth A. Sweeney, Lowell L. Wood, JR.
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Patent number: 9023723Abstract: A method of fabricating a self-aligned buried wordline in a structure which contains a self-aligned buried bit line, where the overall structure which makes up a portion of a vertical channel DRAM. The materials and processes used enable self-alignment of elements of the buried wordline during the fabrication process. In addition, the materials and processes used enable for formation of individual DRAM cells which have a buried bit line width which is 16 nm or less and a perpendicular buried wordline width which is 24 nm or less.Type: GrantFiled: May 9, 2013Date of Patent: May 5, 2015Assignee: Applied Materials, Inc.Inventors: Chorng-Ping Chang, Er-Xuan Ping, Judon Tony Pan
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Publication number: 20140020787Abstract: A method of transporting liquefied breathing gases in underground mines includes providing a conduit system that extends within a mine shaft to a work space below ground where the conduit system includes an outlet positioned in the work space, delivering liquefied breathing gases through the conduit system, and vaporizing the liquefied breathing gases at the outlet of the conduit system.Type: ApplicationFiled: July 19, 2012Publication date: January 23, 2014Inventors: Michael H. Baym, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Conor L. Myhrvold, Nathan P. Myhrvold, Tony Pan, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, JR., Victoria Y.H. Wood
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Publication number: 20130323920Abstract: A method of fabricating a self-aligned buried wordline in a structure which contains a self-aligned buried bit line, where the overall structure which makes up a portion of a vertical channel DRAM. The materials and processes used enable self-alignment of elements of the buried wordline during the fabrication process. In addition, the materials and processes used enable for formation of individual DRAM cells which have a buried bit line width which is 16 nm or less and a perpendicular buried wordline width which is 24 nm or less.Type: ApplicationFiled: May 9, 2013Publication date: December 5, 2013Inventors: Chorng-Ping Chang, Er-Xuan Ping, Judon Tony Pan
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Publication number: 20130261372Abstract: Devices, methods, and compositions are described that includes an implantable device including one or more compartments. One or more pharmaceutically effective compounds stabilized in a sugar glass composition, at least one of the one or more stabilized pharmaceutically effective compounds in the sugar glass composition enclosed within the one or more compartments; and one or more reservoirs configured to provide access for one or more release agents to an interior of the sugar glass composition, wherein the one or more reservoirs are configured to controllably dispense the one or more release agents to disrupt the sugar glass composition from the interior of the sugar glass composition.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventors: Roderick A. Hyde, Jordin T. Kare, Gary L. McKnight, Nathan P. Myhrvold, Tony Pan, Elizabeth A. Sweeney, Lowell L. Wood, JR.
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Publication number: 20130261593Abstract: Devices, methods, and compositions are described that includes an implantable device including one or more compartments. One or more pharmaceutically effective compounds stabilized in a sugar glass composition, at least one of the one or more stabilized pharmaceutically effective compounds in the sugar glass composition enclosed within the one or more compartments; and one or more reservoirs configured to provide access for one or more release agents to an interior of the sugar glass composition, wherein the one or more reservoirs are configured to controllably dispense the one or more release agents to disrupt the sugar glass composition from the interior of the sugar glass composition.Type: ApplicationFiled: July 20, 2012Publication date: October 3, 2013Inventors: Roderick A. Hyde, Jordin T. Kare, Gary L. McKnight, Nathan P. Myhrvold, Tony Pan, Elizabeth A. Sweeney, Lowell L. Wood, JR.
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Patent number: 6913511Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.Type: GrantFiled: November 25, 2003Date of Patent: July 5, 2005Assignee: Applied Materials, Inc.Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek
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Publication number: 20040116047Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.Type: ApplicationFiled: November 25, 2003Publication date: June 17, 2004Applicant: Applied Materials, Inc., a Delaware corporationInventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek
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Publication number: 20040007325Abstract: A method is provided that includes (1) receiving information about a substrate processed within a low K dielectric deposition subsystem from an integrated inspection system of the low K dielectric deposition subsystem; (2) determining an etch process to perform within an etch subsystem based at least in part on the information received from the inspection system of the low K dielectric deposition subsystem; and (3) directing the etch subsystem to etch at least one low K dielectric layer on the substrate based on the etch process. Other methods, systems, apparatus, data structures and computer program products are provided.Type: ApplicationFiled: June 11, 2003Publication date: January 15, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Judon Tony Pan, Michael D. Armacost, Hoiman Hung, Hongwen Li, Arulkumar Shanmugasundram, Moshe Sarfaty, Dimitris P. Lymberopoulos, Mehul Naik
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Patent number: 6659842Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.Type: GrantFiled: August 14, 2001Date of Patent: December 9, 2003Assignee: Applied Materials Inc.Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Buguslaw Swedek, Manoocher Birang
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Patent number: 6652355Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.Type: GrantFiled: June 4, 2001Date of Patent: November 25, 2003Assignee: Applied Materials, Inc.Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek
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Publication number: 20020013120Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.Type: ApplicationFiled: August 14, 2001Publication date: January 31, 2002Applicant: Applied Materials, a Delaware corporationInventors: Andreas Norbert Wiswesser, Judon Tony Pan, Buguslaw Swedek, Manoocher Birang
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Publication number: 20010036793Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.Type: ApplicationFiled: June 4, 2001Publication date: November 1, 2001Applicant: Applied Materials, Inc., a Delaware corporationInventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek
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Patent number: 6296548Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.Type: GrantFiled: June 8, 2000Date of Patent: October 2, 2001Assignee: Applied Materials, Inc.Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek, Manoocher Birang
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Patent number: 6280289Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.Type: GrantFiled: November 2, 1998Date of Patent: August 28, 2001Assignee: Applied Materials, Inc.Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Boguslaw Swedek